Metallized film with gradual change type sheet resistance structure

A metallized film, gradient technology, applied in the direction of thin film/thick film capacitors, laminated capacitors, etc., can solve the problems of poor bonding between gold spray and metalized film thickened coating, thickened edge lodging, capacitor ESR, etc. The effect of reducing the ESR value, increasing the operating temperature, and ensuring the overcurrent capability

Active Publication Date: 2021-11-23
NANTONG XINJIANGHAI POWER ELECTRONICS
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  • Abstract
  • Description
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AI Technical Summary

Problems solved by technology

However, since the gradual trend is more obvious
After the metallized film is rolled up, uncontrollable thickened edge lodging occurs during the gold spraying process
As a result, poor bonding between gold spraying and metallized thin film thickening coating
Capacitors with high ESR are prone to heat failure

Method used

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  • Metallized film with gradual change type sheet resistance structure
  • Metallized film with gradual change type sheet resistance structure
  • Metallized film with gradual change type sheet resistance structure

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Embodiment Construction

[0018] In describing the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Orientation indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The positional relationship is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, Therefore, it should not be construed as limiting the invention.

[0019] In the description of the present invention, "plurality" means two or more, unless otherwise specifically defined.

[0020] see Figure 1-2 , the present invention provides a kind of technical scheme:

[0021] A metallized film with ...

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Abstract

The invention discloses a metalized film with a gradual change type sheet resistance structure, and belongs to the technical field of electronic components. The metalized film with a gradual change type sheet resistance structure comprises a base film, a metal layer and a blank margin, a thickening layer aligned with the side edge of the metal layer is arranged on the metal spraying side, away from the blank margin, of the metal layer, and the thickening layer is composed of three continuous gradual change areas with the thickness gradually changed. The gradual change area comprises a base layer I, a gradual change area II connected with the base layer I and a gradual change area III extending to the blank margin. Compared with a traditional two-section gradual change type sheet resistance structure, the three-section gradual change type thickened structure is adopted, and the change trend of the coating thickness of the gradual change area IIb is mainly increased. According to the metallized film, the lodging of the metal edge, namely the base layer Ia, caused by an overlarge sheet resistance gradual change trend during metal spraying after the metallized film is coiled is greatly relieved, the contact area of sprayed metal and a metallized film plating layer is increased, the overcurrent capability of a capacitor product is ensured, the ESR value of the capacitor product is reduced, and thus the use temperature of the capacitor is increased.

Description

technical field [0001] The invention relates to the technical field of electronic components, more specifically, to a metallized film with a gradient square resistance structure. Background technique [0002] At present, the metallized film used in metallized film capacitors usually adopts a structure with thickened edges on one side and no plating on one side (reserved edges) (see attached figure 1 ). The purpose of thickening is to ensure the connection between the gold spray and the metallized film and reduce the contact resistance. However, the overcurrent capability and self-healing performance of metallized films have always been a contradiction. [0003] At present, some scholars have proposed to use a gradient square resistance structure to solve this problem. However, due to the gradual trend is more obvious. After the metallized film is rolled up, uncontrollable thickened edge lodging occurs during the gold spraying process. As a result, the combination of gol...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/33
CPCH01G4/33
Inventor 姚松顾邵伟施骅峰
Owner NANTONG XINJIANGHAI POWER ELECTRONICS
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