31results about How to "Lower ESR value" patented technology

The invention relates to a low-ESR cathode of a low-ESR tantalum electrolytic capacitor and a preparation method for the cathode, and relates to the technical field of tantalum capacitor manufacturing. The preparation method comprises the steps: preparing a manganese dioxide layer on the surface of a tantalum block with a dielectric oxidation film, wherein the manganese dioxide layer is prepared through a method which comprises the steps: performing the dipping of the tantalum block in manganese nitrate solution with different specific gravities for many times, performing the thermal decomposition to obtain a first cathode, performing the dipping of the first cathode in outer mixed solution, performing the decomposition for many times under the temperature from 250 DEG C to 280 DEG C, performing the reinforcement processing, and performing the dipping and thermal decomposition in the outer mixed solution to obtain the electrode, wherein the outer mixed solution is prepared through adding a dispersing agent and a viscosity reducer to the manganese nitrate solution. The method enables the surface of the tantalum block to form compact manganese dioxide shaped like popcorn, thereby completing the manufacturing of the low-ESR electrode, and improving the high-frequency electrical performance of the tantalum electrolytic capacitor.

The invention relates to the technical field of a power electronic capacitor, in particular to a thin film capacitor for a high power three-phase alternating-current filtering occasion. The thin film capacitor has the advantages that the structure is reasonable, the repeated wiring of multiple capacitors is avoided, the size is small, and the application is safer and more reliable. The thin film capacitor comprises capacitor cores, a connecting copper strip, leading-out terminals, an enclosure, a potting compound and a plastic positioning cover, and is characterized in that the number of the capacitor cores is three, the number of the leading-out terminals is three, the three capacitor cores are connected in pairs to form a triangular connection mode through the connecting copper strip, and the connecting ends of the three capacitor cores are respectively and correspondingly connected with the three leading-out terminals through the connecting copper strip.

The invention relates to an anode tantalum block and a preparation method thereof. The anode tantalum block comprises a column-shaped tantalum block body. A side wall of the column-shaped tantalum block body is provided with multiple grooves with equal intervals along a radial direction, each groove passes through two ends of the tantalum block body along an axial direction, the depth of each of the grooves is 5% to 80% of the radius of the tantalum block body, and the ESR value of a non-solid electrolyte tantalum capacitor is reduced. The preparation method of the anode tantalum block comprises the steps of pressing tantalum powder to form a green body of the anode tantalum block and carrying out vacuum sintering. The anode tantalum block which effectively reduces the ESR value of the non-solid electrolyte tantalum capacitor is prepared, and the industrial production is facilitated at the same time.

A conductive paste for a solid electrolytic capacitor electrode contains an electroconductive powder having a mean particle size of no more than 1 μm and at least 90% thereof having a particle size of at least 0.3 μm; an organic binder; and a solvent.

The invention discloses ultra-low ESR low-temperature curing silver paste and a preparation method thereof. The ultra-low ESR low-temperature curing silver paste comprises silver powder, an organic carrier and an additive, wherein the silver powder is mixed flake silver powder of flake silver powder with different particle sizes, the organic carrier comprises a resin, an organic solvent, a curing agent and an accelerant, the resin is ethyl cellulose resin or one or more of epoxy resin and phenolic resin, the organic solvent is composed of one or more of DBE, diethylene glycol butyl ether acetate, dimethyl glutarate and butyl carbitol, the curing agent is blocked isocyanate or dicyandiamide or imidazole, and the additive is one or a mixture of more of triglycerol acetate and fumed silica. According to the invention, the problem that existing organic tantalum capacitor leading-out end silver paste is large in ESR and unstable is solved, and the ultra-low ESR low-temperature curing silver paste is widely applied to the electrode material of the organic tantalum capacitor leading-out end.

The invention provides an oxidizer solution for conductive high polymer synthesis. The oxidizer solution for conductive high polymer synthesis can be mixed with a polymerized monomer and is used for impregnating a capacitor core package to generate a conductive high polymer through reaction so as to be used for producing a high-performance solid electrolytic capacitor. The oxidizer solution for conductive high polymer synthesis comprises iron sulfonate and solvent, wherein the solvent is lower alcohol and cyclic ether, and the lower alcohol is selected from one or some of monobasic alcohol of which the carbon atom number is 1-4; and the number of oxygen groups of an ether bond in the cyclic ether is 1 or 2, and the ring containing the ether bond is a five-membered one or six-membered one. By using the oxidizer to synthesize a conductive high molecular polymer, the conductivity of the conductive polymer can be improved, thereby reducing the ESR (equivalent series resistance) value of a capacitor.

The invention provides a surface-packaged capacitor and a manufacturing method of the surface-packaged capacitor. The surface-packaged capacitor comprises an anode element and a cathode element whichare isolated from each other, an anode outgoing line; a substrate, wherein an anode connecting groove and a cathode connecting groove are formed in the substrate, and conductors are arranged in the anode connecting groove and the cathode connecting groove; an anode bottom surface terminal which is connected with a notch in one side of the anode connecting groove, wherein one end of the electric conductor arranged in the anode connecting groove is connected with the anode leading-out wire, and the other end of the electric conductor arranged in the anode connecting groove is connected with theupper surface of the anode bottom surface terminal; a cathode bottom surface terminal which is connected with a notch in one side of the cathode connecting groove, wherein one end of the electric conductor arranged in the cathode connecting groove is connected with the cathode element, and the other end of the electric conductor arranged in the cathode connecting groove is connected with the uppersurface of the cathode bottom surface terminal. Through the above structure arrangement, the ESR value of the surface-packaged capacitor is reduced, and the reliability of the surface-packaged capacitor is improved.

The invention discloses a low-loss square capacitor, which comprises a core cladding, an aluminum shell and an aluminum cover used for sealing the core cladding in the aluminum shell. The core cladding comprises positive electrode foil, negative electrode foil, electrolytic paper arranged between the positive electrode foil and the negative electrode foil, a positive electrode lead wire connectedwith the positive electrode foil, and a negative electrode lead wire connected with the negative electrode foil. The positive electrode lead wire and the negative electrode lead wire penetrate the aluminum cover and extend out of the aluminum cover. The core cladding is a laminated core cladding. The positive electrode foil and the negative electrode foil are sintered foil, a plurality of laminated positive electrode tabs are arranged on the positive electrode foil, and a plurality of laminated negative electrode tabs are arranged on the negative electrode foil. A positive electrode welding region used for welding the plurality of positive electrode tabs with the positive electrode lead wire is reserved on the outer surface of each positive electrode tab. A negative electrode welding region used for welding the plurality of negative electrode tabs with the negative electrode lead wire is reserved on the outer surface of each negative electrode tab. The low-loss square capacitor disclosed by the invention has the advantages of compact structure, high impregnation efficiency, small ESR value, and fully utilized internal space.

An anti-vibration laminated solid aluminum electrolytic capacitor comprises a sealing assembly and a core fixedly arranged in the sealing assembly, the core is electrically connected with a positive guide pin and a negative guide pin, and the positive guide pin and the negative guide pin penetrate out of the sealing assembly; the core is composed of a plurality of stacked single sheets, and each single sheet comprises a positive electrode end, a negative electrode end and a shielding glue wire located between the positive electrode end and the negative electrode end; the positive electrode end of the single sheet is provided with a positive electrode fixing terminal, the positive electrode guide pin is connected with the positive electrode fixing terminal, the negative electrode end of the single sheet is provided with a negative electrode fixing terminal, and the negative electrode guide pin is connected with the negative electrode fixing terminal. The positive electrode fixing terminal and the negative electrode fixing terminal are adopted to fix the positive electrode ends and the negative electrode ends of the stacked single sheets respectively, the stacked single sheets can be effectively prevented from loosening due to the influence of the external environment in the assembling process of the capacitor and the using process of the capacitor, and therefore the electrical performance of the capacitor is stable.

The invention discloses a solid tantalum capacitor with an extremely low ESR value and a leading-out welding sheet at a gold plating end. The solid tantalum capacitor comprises a tantalum core and a tantalum wire, wherein an epoxy resin encapsulation layer wraps the tantalum core, a positive electrode gold plating cap and a negative electrode gold plating cap are respectively arranged at two endsof the encapsulation layer, the negative electrode gold plating cap is arranged at an opening end of the encapsulation layer, and the negative electrode gold plating cap and the tantalum core are connected by a surface welding mode. Spot welding between an existing wire and the tantalum wire is changed to contact surface welding, and the ESR value of the tantalum capacitor can be effectively reduced by large-area welding; and moreover, existing positive/negative pole plate tin plating is changed to gold plating cap leading out, the conductivity of a welding position can be greatly improved, and the contact resistance of the tantalum capacitor on a circuit board also can be greatly reduced.

The invention discloses a metalized film with a gradual change type sheet resistance structure, and belongs to the technical field of electronic components. The metalized film with a gradual change type sheet resistance structure comprises a base film, a metal layer and a blank margin, a thickening layer aligned with the side edge of the metal layer is arranged on the metal spraying side, away from the blank margin, of the metal layer, and the thickening layer is composed of three continuous gradual change areas with the thickness gradually changed. The gradual change area comprises a base layer I, a gradual change area II connected with the base layer I and a gradual change area III extending to the blank margin. Compared with a traditional two-section gradual change type sheet resistance structure, the three-section gradual change type thickened structure is adopted, and the change trend of the coating thickness of the gradual change area IIb is mainly increased. According to the metallized film, the lodging of the metal edge, namely the base layer Ia, caused by an overlarge sheet resistance gradual change trend during metal spraying after the metallized film is coiled is greatly relieved, the contact area of sprayed metal and a metallized film plating layer is increased, the overcurrent capability of a capacitor product is ensured, the ESR value of the capacitor product is reduced, and thus the use temperature of the capacitor is increased.

The invention provides a solid-state capacitor negative carbon foil comprising a corrosion aluminum foil and a conductive layer. The conductive layer wraps the surface of the corrosion aluminum foil.The conductive layer comprises a conductive high-molecular polymer layer and a carbon conductive layer. The conductive high-molecular polymer layer wraps the surface of the corrosion aluminum foil orthe surface of the corrosion aluminum foil coated with the carbon conductive layer. One conductive high-molecular polymer layer and one carbon conductive layer wrap the conventional corrosion aluminumfoil and the solid-state capacitor negative carbon foil having the simple structure is obtained, the solid-state capacitor negative carbon foil can be prepared by only using the conventional coatingmethod, and the solid-state capacitor prepared by using the negative foil has the advantages of high capacity, low loss and low ESR value.