Looking for breakthrough ideas for innovation challenges? Try Patsnap Eureka!

Surface-packaged capacitor and manufacturing method of surface-packaged capacitor

A surface packaging and capacitor technology, applied in the field of capacitors, can solve the problems of high risk of use, large ESR value of surface packaging capacitors, unstable connection of surface packaging capacitors, etc., to improve the overall performance, reduce the difficulty of production, and ensure the effect of connection.

Pending Publication Date: 2021-03-02
CHINA ZHENHUA GRP XINYUN ELECTRONICS COMP ANDDEV CO LTD
View PDF0 Cites 1 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The purpose of the embodiments of the present application is to provide a surface mount capacitor and a method for manufacturing a surface mount capacitor, so as to improve the problem of "current surface mount capacitors are unstable in connection, high in use risk, and have a large ESR value"

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Surface-packaged capacitor and manufacturing method of surface-packaged capacitor
  • Surface-packaged capacitor and manufacturing method of surface-packaged capacitor
  • Surface-packaged capacitor and manufacturing method of surface-packaged capacitor

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 2

[0107] The substrate is laser engraved with a hole / terminal, and the conductive paste is filled into the hole, and then the anode block is bonded to the substrate, and the other processes are the same as Comparative Example 2.

[0108] Effect verification example 2: Please continue to refer to Figure 13 , the effect verification example 1 of circuit design and parameters is the same, but during this verification, only 3 capacitors of comparative example 2 and 3 capacitors of embodiment 2 of this application are used to install in the line (capacitors are installed in the marked CAP in the diagram position), the peak-to-peak value of the CPU power supply terminal voltage was measured, and the data are listed in Table 2.

[0109] Data comparison:

[0110] For the target product 6.3V 220uF conductive polymer aluminum capacitor, test the ESR of the comparative product (as shown in Table 2 below):

[0111] Table 2

[0112]

[0113] From the comparison of the data in Table 2 ...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
densityaaaaaaaaaa
Login to View More

Abstract

The invention provides a surface-packaged capacitor and a manufacturing method of the surface-packaged capacitor. The surface-packaged capacitor comprises an anode element and a cathode element whichare isolated from each other, an anode outgoing line; a substrate, wherein an anode connecting groove and a cathode connecting groove are formed in the substrate, and conductors are arranged in the anode connecting groove and the cathode connecting groove; an anode bottom surface terminal which is connected with a notch in one side of the anode connecting groove, wherein one end of the electric conductor arranged in the anode connecting groove is connected with the anode leading-out wire, and the other end of the electric conductor arranged in the anode connecting groove is connected with theupper surface of the anode bottom surface terminal; a cathode bottom surface terminal which is connected with a notch in one side of the cathode connecting groove, wherein one end of the electric conductor arranged in the cathode connecting groove is connected with the cathode element, and the other end of the electric conductor arranged in the cathode connecting groove is connected with the uppersurface of the cathode bottom surface terminal. Through the above structure arrangement, the ESR value of the surface-packaged capacitor is reduced, and the reliability of the surface-packaged capacitor is improved.

Description

technical field [0001] The present application relates to the technical field of capacitors, in particular, to a surface mount capacitor and a method for manufacturing the surface mount capacitor. Background technique [0002] In current surface mount capacitors, the terminals are drawn out mainly by the cathode terminal and the anode terminal to lead the interior to the bottom terminal. This method has a small connection area and a single lead-out path, which makes the connection of the surface mount capacitor unstable and high in use risk, and this method makes the ESR (Equivalent Series Resistance, equivalent series resistance) value of the surface mount capacitor also large. Contents of the invention [0003] The purpose of the embodiments of the present application is to provide a surface mount capacitor and a method for manufacturing a surface mount capacitor, so as to improve the problem of "current surface mount capacitors are unstable in connection, high in use ri...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Applications(China)
IPC IPC(8): H01G4/228H01G4/224
CPCH01G4/228H01G4/224
Inventor 宁连才黄建耀杨凯
Owner CHINA ZHENHUA GRP XINYUN ELECTRONICS COMP ANDDEV CO LTD
Who we serve
  • R&D Engineer
  • R&D Manager
  • IP Professional
Why Patsnap Eureka
  • Industry Leading Data Capabilities
  • Powerful AI technology
  • Patent DNA Extraction
Social media
Patsnap Eureka Blog
Learn More
PatSnap group products

Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.

© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com