Production process of negative electrode foil and negative electrode foil and polymer solid aluminum electrolytic capacitor

Abstract

The present invention relates to a production process of negative electrode foil and a negative electrode foil and a polymer solid aluminum electrolytic capacitor. The production process of the negative electrode foil includes the following steps: S1, selecting an aluminum substrate; S2, forming a dielectric layer process, which includes the following steps: a) Preparation of slurry; b) Etching the surface of the aluminum substrate to form holes, then coating the slurry on the surface of the aluminum substrate with holes, drying the surface, and then sending it into the rolling machine, Press the coating into the hole and compact it on the surface of the hole and the aluminum substrate; c), carbonization treatment. Under the premise of increasing the specific capacity, the negative electrode foil of the present invention is obviously thinner than the negative electrode foil used in the same capacity, and at the same time, the polymer solid aluminum electrolytic capacitor produced by the negative electrode foil has a significantly smaller volume among products with the same capacity. The ESR value has also become smaller, while contributing to the miniaturization and current withstand capability of polymer solid aluminum electrolytic capacitors.

Description

Technical field

[0001] The present invention belongs to the field of capacitor, and more particularly to a negative electrode foil, and further relates to a production process of a negative electrode foil and a polymer solid aluminum electrolytic capacitor manufactured by the negative electrode foil.Background technique

[0002] It is well known that small-scale electronic components have always been a hot spot in industry. In recent years, in the fields of civilian consumer electronics, industrial manufacturing, automotive electronics, or military communications, various intelligent terminals have developed rapidly. The implementation of these terminal functions does not require miniaturized components support, and more features in limited space have become an inevitable trend, and the demand for miniaturization of components will continue.

[0003] Capacitors are an essential device as the base component in electronics, generally used as a communication resistance, filter, bypass, coupling,...

Examples

Embodiment 1

[0041]Seefigure 1 withfigure 2 As shown, the present embodiment provides an anode foil comprising an aluminum substrate 1, a dielectric layer 2 formed on the surface of the aluminum substrate 1.

[0042]Specifically, the negative electrode foil production process is as follows:

[0043]S1, select aluminum substrate, which is selected from 99.5%, and a aluminum foil having a thickness of 30 μm is an aluminum substrate.

[0044]S2, forming a dielectric layer step comprising the step of: a), a slurry; b), first etch the aluminum substrate surface to form a hole, then apply the slurry to the surface of the aluminum substrate having a hole, The surface is drying, followed by a rolling machine, press the coating into the hole and press the surface of the hole and the aluminum substrate; c), carbonization treatment.

[0045]In step a), the oxide dielectric particles of the valve metal, the metal particles, the organic resin, the dispersant, and the solvent are ingredient in mass ratio of 1: 0.15: 0.6:...

Embodiment 2

[0058]The negative electrode foil according to the present embodiment, its structure and processes are basically the same as those of Example 1, and different are:

[0059]1), the formation process of the holes in this example is to put the selected aluminum substrate into a concentration of 0.5 mol / L, the temperature of the hydrochloric acid solution of 80 ° C, and then washed with a 3 wt% nitric aqueous solution, and then again Wash the water and dry.

[0060]Specifically, the hole diameter of the hole 10 is 150 to 250 nm, the hole depth of the hole is 450 to 550 nm, and the distribution density of the surface of the hole in the surface of the aluminum substrate 1 is 1 × 104 / Cm2.

[0061]In this example, the titanium dioxide particles, silver particles, organic resins, dispersants and solvents are blended at a mass ratio of 1: 0.10: 0.6 :0.0002: 8, and mix well and mix well.

[0062]In this example, the surface slurry coating coated in an aluminum substrate is dried in a tunnel furnace of ...

Embodiment 3

[0067]The negative electrode foil according to the present embodiment, its structure and processes are basically the same as those of Example 1, and different are:

[0068]1), the formation process of the holes in this example is to put the selected aluminum substrate in a concentration of 1 mol / L, a temperature of 80 ° C, soaking 20s, followed by washing with a 3 wt% nitric aqueous solution, and then use water Rinse and dry.

[0069]Specifically, the aperture 10 has a hole diameter of 250 to 300 nm, the hole depth of the hole is 600 to 700 nm, and the distribution density of the surface of the hole in the aluminum substrate 1 is 4 × 105 / Cm2.

[0070]In this example, titanium dioxide particles, silver particles, organic resins, dispersants, and solvents are blended at a mass ratio of 1: 0.2: 0.6: 0.0002: 8, stir mix and mix, and are made into a slurry.

[0071]In this example, the surface slurry coating coated on the aluminum substrate is dried in a tunnel furnace of 110 ± 5 ° C, dried 240s,...

Technical field

[0001] The present invention belongs to the field of capacitor, and more particularly to a negative electrode foil, and further relates to a production process of a negative electrode foil and a polymer solid aluminum electrolytic capacitor manufactured by the negative electrode foil.Background technique

[0002] It is well known that small-scale electronic components have always been a hot spot in industry. In recent years, in the fields of civilian consumer electronics, industrial manufacturing, automotive electronics, or military communications, various intelligent terminals have developed rapidly. The implementation of these terminal functions does not require miniaturized components support, and more features in limited space have become an inevitable trend, and the demand for miniaturization of components will continue.

[0003] Capacitors are an essential device as the base component in electronics, generally used as a communication resistance, filter, bypass, coupling,...

Examples

Embodiment 1

[0041]Seefigure 1 withfigure 2 As shown, the present embodiment provides an anode foil comprising an aluminum substrate 1, a dielectric layer 2 formed on the surface of the aluminum substrate 1.

[0042]Specifically, the negative electrode foil production process is as follows:

[0043]S1, select aluminum substrate, which is selected from 99.5%, and a aluminum foil having a thickness of 30 μm is an aluminum substrate.

[0044]S2, forming a dielectric layer step comprising the step of: a), a slurry; b), first etch the aluminum substrate surface to form a hole, then apply the slurry to the surface of the aluminum substrate having a hole, The surface is drying, followed by a rolling machine, press the coating into the hole and press the surface of the hole and the aluminum substrate; c), carbonization treatment.

[0045]In step a), the oxide dielectric particles of the valve metal, the metal particles, the organic resin, the dispersant, and the solvent are ingredient in mass ratio of 1: 0.15: 0.6:...

Embodiment 2

[0058]The negative electrode foil according to the present embodiment, its structure and processes are basically the same as those of Example 1, and different are:

[0059]1), the formation process of the holes in this example is to put the selected aluminum substrate into a concentration of 0.5 mol / L, the temperature of the hydrochloric acid solution of 80 ° C, and then washed with a 3 wt% nitric aqueous solution, and then again Wash the water and dry.

[0060]Specifically, the hole diameter of the hole 10 is 150 to 250 nm, the hole depth of the hole is 450 to 550 nm, and the distribution density of the surface of the hole in the surface of the aluminum substrate 1 is 1 × 104 / Cm2.

[0061]In this example, the titanium dioxide particles, silver particles, organic resins, dispersants and solvents are blended at a mass ratio of 1: 0.10: 0.6 :0.0002: 8, and mix well and mix well.

[0062]In this example, the surface slurry coating coated in an aluminum substrate is dried in a tunnel furnace of ...

Embodiment 3

[0067]The negative electrode foil according to the present embodiment, its structure and processes are basically the same as those of Example 1, and different are:

[0068]1), the formation process of the holes in this example is to put the selected aluminum substrate in a concentration of 1 mol / L, a temperature of 80 ° C, soaking 20s, followed by washing with a 3 wt% nitric aqueous solution, and then use water Rinse and dry.

[0069]Specifically, the aperture 10 has a hole diameter of 250 to 300 nm, the hole depth of the hole is 600 to 700 nm, and the distribution density of the surface of the hole in the aluminum substrate 1 is 4 × 105 / Cm2.

[0070]In this example, titanium dioxide particles, silver particles, organic resins, dispersants, and solvents are blended at a mass ratio of 1: 0.2: 0.6: 0.0002: 8, stir mix and mix, and are made into a slurry.

[0071]In this example, the surface slurry coating coated on the aluminum substrate is dried in a tunnel furnace of 110 ± 5 ° C, dried 240s,...

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