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Solid tantalum capacitor and its manufacturing process

A tantalum capacitor, solid-state technology, applied in the field of solid-state tantalum capacitors and their manufacturing processes, can solve the problems of high ESR, unsatisfactory use reliability, and low capacity, etc. The effect of large capacity

Active Publication Date: 2021-10-01
ZHUZHOU HONGDA ELECTRONICS
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The existing tantalum capacitors either have a large ESR due to the non-solid electrolyte, or the capacity of the solid tantalum capacitors is not large due to the withstand voltage requirements of the solid tantalum capacitors. The reliability of the capacitor cannot meet the requirements of the whole machine. In order to solve this problem, we invented a solid tantalum capacitor

Method used

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  • Solid tantalum capacitor and its manufacturing process
  • Solid tantalum capacitor and its manufacturing process
  • Solid tantalum capacitor and its manufacturing process

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Embodiment Construction

[0041] Combine below Figure 1 to Figure 4 The embodiments of the present invention are described in detail.

[0042]A solid tantalum capacitor, including a tantalum capacitor body, a tantalum capacitor body including a tantalum core 1, an anode lead-out plate 2 connected to a tantalum wire 11 embedded in the tantalum core 1, a cathode lead 3, a metal shell 4 and a glass powder insulator 5, a plurality of The tantalum core 1 is sequentially fixed in the metal shell 4 by tin solder or conductive silver paste, and the metal shell 4 is encapsulated by the glass powder insulator 5, and the characteristic is that the anode lead-out plate 2 is installed in the metal shell 4 and is located between the glass powder insulator 5 and the tantalum core. 1, the anode wire 21 of the anode lead-out plate 2 passes through the glass powder insulator 5 as the anode lead of the capacitor, the cathode lead 3 is inserted into the metal shell 4 and welded with the glass powder insulator 5 and the m...

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Abstract

Solid tantalum capacitor and its manufacturing process, including tantalum capacitor body, tantalum capacitor body including tantalum core, anode lead-out plate, cathode lead, metal shell and glass powder insulator, multiple tantalum cores are sequentially fixed on the metal shell by tin solder or conductive silver paste Among them, the metal shell is encapsulated by a glass powder insulator, the anode lead-out plate is installed in the metal shell and is located between the glass powder insulator and the tantalum core, the anode wire of the anode lead-out plate passes through the glass powder insulator as the anode lead of the capacitor, and the cathode lead is inserted into the metal In the shell and welded with the glass powder insulator and the metal shell, the tantalum core is a porous matrix formed by pressing a cuboid made of high-volume tantalum powder and sintered under high-temperature vacuum, and the tantalum core is covered by electroplating, coating or impregnation. There is a conductive polymer layer, and the tantalum core has jagged sides with alternating convex and concave. The invention greatly reduces the ESR value of the capacitor while the capacitor provides a large capacitance, and the reliability of the capacitor is higher.

Description

technical field [0001] The invention relates to a solid tantalum capacitor and a manufacturing process thereof, belonging to the field of solid tantalum capacitor manufacturing. Background technique [0002] Solid tantalum capacitor is a polar component. In microelectronic circuits, the unidirectional conductivity of its dielectric layer can be used for filtering, filtering out the residual AC ripple signal in the DC signal or making its amplitude smaller. The solid tantalum capacitor Tantalum capacitors are characterized by long life, high temperature resistance, high accuracy, excellent performance in filtering high-frequency harmonics, and various forms, excellent volume efficiency, with their unique characteristics, and their application range is becoming wider and wider. At present, with the development of electronic technology and military electronic components, as well as the need for miniaturization, light weight and high performance of modern weapons and equipment, ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G4/005H01G4/008H01G4/06H01G4/30
CPCH01G4/005H01G4/008H01G4/06H01G4/30
Inventor 易金锋
Owner ZHUZHOU HONGDA ELECTRONICS
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