Ultra-low ESR low-temperature curing silver paste and preparation method thereof

A low-temperature, ultra-low technology, applied in cable/conductor manufacturing, used in heat treatment equipment, conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problems of large ESR and instability of silver paste

Inactive Publication Date: 2021-04-27
CHINA ZHENHUA GRP YUNKE ELECTRONICS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] The purpose of the invention is to solve the problem that the ESR of the silve...

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] First prepare the following raw materials according to mass percentage:

[0041] Silver powder 65%, organic carrier 33%, additive 2%;

[0042] The above-mentioned silver powder is mixed flaky silver powder with a particle diameter of 1 μm-5 μm and 5 μm-10 μm.

[0043] Prepare the slurry according to the following process:

[0044] Powder mixing: First, according to the mass percentage of 1:1, weigh flake silver powder with a particle size of 1 μm to 5 μm and 5 μm to 10 μm, and mix them together for later use;

[0045] Preparation of organic carrier: dissolve 30% ethyl cellulose resin into 70% butyl carbitol according to the mass percentage, heat at 80°C at a constant temperature until completely dissolved, cool down to room temperature after the dissolution is complete, and press Dissolve 20% epoxy resin TDE85 into DBE, add 5% curing agent imidazole and accelerator, disperse at high speed for 30 minutes, filter through 300 mesh screen, and cool to obtain a mixed organ...

Embodiment 2

[0049] First prepare the following raw materials according to mass percentage:

[0050] Silver powder 60%, organic carrier 38%, additive 2%;

[0051] The above-mentioned silver powder is flake silver powder with a particle diameter of 1 μm˜10 μm, and the ratio by weight is 2:1.

[0052] Prepare the slurry according to the following process:

[0053] Powder mixing: First, according to the mass percentage of 2:1, weigh flake silver powder with a particle size of 1 μm to 5 μm and 5 μm to 10 μm, and mix them together for later use;

[0054] Preparation of organic carrier: Dissolve 30% of ethyl cellulose resin in 70% of butyl carbitol by mass percentage, heat at 80°C at a constant temperature until completely dissolved, cool down to room temperature after complete dissolution, and press Dissolve 20% of epoxy resin TDE85 into DBE, add 5% of curing agent imidazole, disperse at high speed for 30 minutes, filter through 300-mesh screen, and cool to obtain organic vehicle;

[0055] M...

Embodiment 3

[0058] First prepare the following raw materials according to mass percentage:

[0059] Silver powder 65%, organic carrier 33%, additive 2%;

[0060] The above-mentioned silver powder is flake silver powder with a particle diameter of 1 μm˜10 μm. The additive is leveling agent triglyceride acetate.

[0061] Prepare the slurry according to the following process:

[0062] Powder mixing: First, according to the mass percentage of 1:2, weigh flake silver powder with a particle size of 1 μm to 5 μm and 5 μm to 10 μm, and mix them together for later use;

[0063] Preparation of organic vehicle: Preparation of organic vehicle: dissolve 30% ethyl cellulose resin in 70% butyl carbitol by mass percentage, heat at a constant temperature at 80°C until completely dissolved, and drop to to room temperature, then dissolve 20% epoxy resin TDE85 into DBE according to the mass percentage, add 5% curing agent imidazole, disperse at high speed for 30min, filter through a 300-mesh screen, and coo...

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Abstract

The invention discloses ultra-low ESR low-temperature curing silver paste and a preparation method thereof. The ultra-low ESR low-temperature curing silver paste comprises silver powder, an organic carrier and an additive, wherein the silver powder is mixed flake silver powder of flake silver powder with different particle sizes, the organic carrier comprises a resin, an organic solvent, a curing agent and an accelerant, the resin is ethyl cellulose resin or one or more of epoxy resin and phenolic resin, the organic solvent is composed of one or more of DBE, diethylene glycol butyl ether acetate, dimethyl glutarate and butyl carbitol, the curing agent is blocked isocyanate or dicyandiamide or imidazole, and the additive is one or a mixture of more of triglycerol acetate and fumed silica. According to the invention, the problem that existing organic tantalum capacitor leading-out end silver paste is large in ESR and unstable is solved, and the ultra-low ESR low-temperature curing silver paste is widely applied to the electrode material of the organic tantalum capacitor leading-out end.

Description

technical field [0001] The invention belongs to the field of electronic components, specifically to the field of organic tantalum capacitors, and further to the field of organic tantalum capacitor lead-out electrode materials. Background technique [0002] In recent years, with the rapid development of the electronic information industry, the demand for tantalum capacitors in the downstream electronics industry has greatly increased. Daily mobile phones, notebook computers, tablet computers, e-books and automobile airbags all need tantalum capacitors. In terms of modern equipment, electronic information control equipment is continuously introduced, and tantalum capacitors are increasingly relied on: the construction of 5G networks and its user terminals, as well as other high-speed data terminals, the huge number of network base stations and the number of users require tantalum capacitors; In terms of automotive electronics, automotive electronics and intelligence are becomi...

Claims

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Application Information

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IPC IPC(8): H01B1/22H01B13/00H01G9/008
CPCH01B1/22H01B13/00H01B13/0016H01G9/008
Inventor 郭明亚安家芳韩玉成姜敬辉韩凤罗廷福
Owner CHINA ZHENHUA GRP YUNKE ELECTRONICS
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