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Chip bonding pad structure, chip, wafer and chip bonding pad structure manufacturing method

A chip pad and manufacturing method technology, applied in semiconductor/solid-state device manufacturing, semiconductor/solid-state device components, semiconductor devices, etc., can solve problems such as chip function failure, avoid virtual soldering, ensure effective contact, and improve reliability. sexual effect

Active Publication Date: 2021-11-30
BEIJING SMARTCHIP MICROELECTRONICS TECH COMPANY +3
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

When in use, the flip chip will encounter the problem of function failure

Method used

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  • Chip bonding pad structure, chip, wafer and chip bonding pad structure manufacturing method
  • Chip bonding pad structure, chip, wafer and chip bonding pad structure manufacturing method
  • Chip bonding pad structure, chip, wafer and chip bonding pad structure manufacturing method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0062] figure 1 It is a schematic diagram of the chip pad structure provided by an embodiment of the present invention, such as figure 1 As shown, the chip pad structure includes:

[0063] The first insulating layer 1 has grooves;

[0064] The first metal layer 3 is filled in the groove of the first insulating layer 1, and the first metal layer 3 is connected with the internal circuit of the chip to form a conductive channel;

[0065] The second metal layer 4 is formed on the first metal layer 3, and the second metal layer 4 has a pad area for connecting the chip to an external device;

[0066] The second insulating layer 2 covers at least the part of the second metal layer 4 outside the pad area and the first metal layer 3;

[0067] The pad area includes a test pad area 5 and a gold bump pad area 6; the gold bump pad area 6 includes a plurality of sub-pad areas. Among them, the test pad area 5 is used for connecting pads for CP testing after the chip is manufactured, and ...

Embodiment 2

[0101] image 3 It is a schematic diagram of the chip pad structure provided by another embodiment of the present invention, such as image 3 As shown, the chip pad structure includes:

[0102] The first insulating layer 1 has grooves;

[0103] The first metal layer 3 is filled in the groove of the first insulating layer 1, and the first metal layer 3 is connected with the internal circuit of the chip to form a conductive channel;

[0104] The second metal layer 4 is formed on the first metal layer 3, and the second metal layer 4 has a pad area for connecting the chip to an external device;

[0105] The second insulating layer 2 covers at least the part of the second metal layer 4 outside the pad area and the first metal layer 3;

[0106] The pad area includes a test pad area 5 and a gold bump pad area 6; the gold bump pad area 6 includes a plurality of sub-pad areas. Among them, the test pad area 5 is used for connecting pads for CP testing after the chip is manufactured,...

Embodiment 3

[0140] Figure 5 It is a schematic diagram of the chip pad structure provided by another embodiment of the present invention, such as image 3 As shown, the chip pad structure includes:

[0141] The first insulating layer 1 has grooves;

[0142] The first metal layer 3 is filled in the groove of the first insulating layer 1, and the first metal layer 3 is connected with the internal circuit of the chip to form a conductive channel;

[0143] The second metal layer 4 is formed on the first metal layer 3, and the second metal layer 4 has a pad area for connecting the chip to an external device;

[0144] The second insulating layer 2 covers at least the part of the second metal layer 4 outside the pad area and the first metal layer 3;

[0145] The pad area includes a test pad area 5 and a gold bump pad area 6; the gold bump pad area 6 includes a plurality of sub-pad areas. Among them, the test pad area 5 is used for connecting pads for CP testing after the chip is manufactured...

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Abstract

The invention provides a chip bonding pad structure, a chip, a wafer and a chip bonding pad structure manufacturing method, and belongs to the field of chips. The chip bonding pad structure includes: a first insulating layer including a groove; a first metal layer, wherein the groove is filled with the first metal layer, and the first metal layer is connected with an internal circuit of a chip to form a conductive channel; a second metal layer formed on the first metal layer and comprising a bonding pad area where the chip is connected with an external device; and a second insulating layer at least covering the part, outside the bonding pad area, of the second metal layer and the first metal layer, wherein the bonding pad area comprising a test bonding pad area and a gold bump bonding pad area, and the gold bump bonding pad area includes a plurality of sub-bonding pad areas. According to the invention, the surface of the gold bump formed by electroplating on the gold bump bonding pad area is free of pits while effective contact between the gold bump and the gold bump bonding pad can be guaranteed, so that the risk of function failure caused by pseudo soldering after chip packaging is reduced.

Description

technical field [0001] The invention relates to the field of chips, in particular to a chip pad structure, a chip, a wafer and a method for manufacturing the chip pad structure. Background technique [0002] In chip packaging technology, the conventional chip packaging process includes two key processes of die bonding and wire bonding, while flip chip (Flip-Chip, FC for short) technology combines the above two key processes into one. It realizes the interconnection between the chip and the packaging substrate (or circuit board) directly through the bumps arranged in an array on the chip. Because the chip is buckled upside down on the packaging substrate, which is opposite to the placement direction of the conventional packaged chip, it is called Flip-Chip. When in use, flip chips suffer from functional failures. Contents of the invention [0003] The purpose of the embodiments of the present invention is to provide a chip pad structure, a chip, a wafer, and a method for ...

Claims

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Application Information

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IPC IPC(8): H01L23/488H01L21/60
CPCH01L24/06H01L24/03H01L2224/0401H01L2224/03H01L2224/0361H01L2224/06515
Inventor 张贺丰林杰李建强李延王文赫
Owner BEIJING SMARTCHIP MICROELECTRONICS TECH COMPANY
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