Manufacturing process and gluing equipment for composite board based on PET film flat pasting

Abstract

The invention discloses a manufacturing process and gluing equipment for a composite board based on PET film flat pasting. The manufacturing process comprises the following steps: step 1, dedusting a substrate; step 2, gluing the substrate; step 3, leveling the substrate; step 4, pasting a film on the substrate; and step 5, curing a composite board. The manufacturing process disclosed by the invention is environment-friendly, simple to operate, short in period and high in manufacturing efficiency. According to the gluing equipment, an automatic adjusting mechanism is adopted, so that when substrates with different thicknesses and models are glued, the gluing distance can be automatically determined, automatic downward moving operation is achieved, the surfaces of the glued substrates are accurately positioned, and the distance consistency between the surface positions of the substrates and the position of a linkage frame is always kept. According to the gluing equipment, original manual adjustment is replaced, automatic adjustment is achieved, operation is easy, use is easy, the adjusting method is optimized, and the machining efficiency of the composite board is effectively improved.

Description

technical field [0001] The invention relates to the technical field of composite board processing, more specifically, the invention relates to a composite board manufacturing process based on PET film flat laying and glue coating equipment. Background technique [0002] The existing decorative composite boards generally include melamine boards, baking varnish boards, art glass, etc., that is, materials with decorative effects are combined on metal, wood boards, glass, and ceramics as substrates to make composite boards with decorative effects. Improve the use value of the substrate. [0003] The production of existing decorative composite boards mostly includes gluing process, sandblasting process and painting process, which is easy to pollute the environment, and the production process is complex, long cycle, and low efficiency. Sticking to the substrate, this manufacturing process needs to be completed under high temperature conditions, so there is a requirement for the m...

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Problems solved by technology

[0003] The production of existing decorative composite boards mostly includes gluing process, sandblasting process and painting process, which is easy to pollute the environment, and the production process is complex, long cycle, and low efficiency. Sticking to the substrate, this manufacturing process needs to be completed under high temperature conditions, so there is a requirement for the manufacturing temperature, resulting in a long production cycle and low efficiency, and the melamine board prepared by this process has decorative, protective, and light-transmitting properties Poor defects; the baking varnish board is made by grinding the surface of the substrate six to nine times, priming, drying, polishing, and baking at high temperature. This manufacturing process has a long production cycle and high technical level requirements. The rate is high, and the price of the baking varnish board prepared by this process is high. It is afraid of bumps and scratches. Once damaged, it is difficult to repair and needs to be replaced as a whole; As a result, this manufacturing process is complex and has a long cycle. The art glass prepared by this process is easy to fade, the time is not long, and the glass is easy to burst

[0004] In the existing production and processing process, most of the gluing process is used, which is especially important for the substrate gluing step. Every time the applied glue is replaced with a different thickness of the substrate, it is necessary to adjust the position of the gluing roller of the equipment. Therefore, it is suitable for gluing operations on substrates of different thicknesses, which requires manual measurement and adjustment, which is very inconvenient to operate, which is not conducive to rapid gluing operations on substrates of different thicknesses, and the processing efficiency is low.

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