Test board for detecting incomplete glue removal of PCB (Printed Circuit Board) and test method thereof
It is a technology of endless glue removal and test board, which is applied in the direction of electronic circuit testing, printed circuit testing, multi-layer circuit manufacturing, etc. It can solve the problems of company losses, delays in delivery, etc., achieve feedback speed improvement, and reduce a large number of scrapping problems. Effect
Pending Publication Date: 2021-12-03
BOMIN ELECTRONICS CO LTD
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Problems solved by technology
This will bring huge losses to the company and delay delivery
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[0049] Such as Figure 1 to Figure 3 as well as Figure 10 and Figure 11 As shown in the present invention, a test board for detecting whether the PCB is not fully deglueable includes a board body 10, and the board body 10 is provided with 4*4 test modules 11 arranged in a matrix, and the test modules 11 are multi-layered. Laminated structure of resin composite pressing. In this embodiment, the total number of layers of the laminated structure is N=18.
[0050] The structure of each test module 11 is the same, and the difference is that the built-in test hole apertures are different, for example, in the present embodiment figure 2 Middle: The diameter of all test holes of No. 1 module is 0.25mm; the diameter of all test holes of No. 2 module is 0.3mm; the diameter of all test holes of No. 3 module is 0.35mm; the diameter of all test holes of No. 4 module is 0.45mm. The arrangement adopts an orthogonal manner, so that each row and each column contains modules 1, 2, 3, and...
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The invention discloses a test board for detecting incomplete glue removal of a PCB and a test method thereof, and provides a scheme aiming at the problem that the test for incomplete glue removal is inconvenient in the prior art. A plurality of through test holes are formed in the test board, and then connection is carried out on the upper, middle and lower inner layer boards in the laminated structure. And the three-dimensional position where glue is not removed completely is obtained by using opening and closing loops of different test holes. The test board has the advantages that the designed test board is placed in the plasma working procedure machining process, and the conduction condition of the test board is verified, so that the problem that a large number of products are scrapped in the later period due to poor plasma parameter setting in the new product manufacturing process is greatly reduced. Slice observation is not needed, and the feedback speed is obviously increased.
Description
technical field [0001] The invention relates to the front-end process of PCB production, in particular to a test board for detecting whether the PCB is not fully deglueable, and also relates to a test method using the test board. Background technique [0002] PCB, that is, printed circuit board, with the advancement of science and technology, the existing PCB uses a multi-layer board composite structure. The dielectric layer (prepreg) itself after multilayer board lamination contains a certain amount of resin, that is, the glue that needs to be removed by the technical method. [0003] During the drilling process of the PCB, the resin will be softened by the heat of the high-speed rotating cutting belt of the drill bit. After the drill bit completes drilling, it will pull the softened resin while pulling it out, and the softened resin will adhere to the inner ring, and the temperature will drop accordingly. The resin hardens again. [0004] The purpose of degumming is to ...
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IPC IPC(8): G01R31/28H05K3/00H05K3/46
CPCG01R31/2801H05K3/0011H05K3/0041H05K3/46Y02W30/82
Inventor 廖金超吴熷坤郭茂桂陈世金许伟廉黄伟梁鸿飞
Owner BOMIN ELECTRONICS CO LTD