Micro-lens automatic coupling packaging equipment

A technology of automatic coupling and packaging equipment, applied in installation, workpiece clamping devices, instruments, etc., can solve the problems of inaccurate positioning, reduced coupling accuracy, and inability to guarantee position accuracy, and achieve the effect of accurate relative position and improved coupling accuracy.

Active Publication Date: 2021-12-03
CENT SOUTH UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Due to the extremely small size of the micro-collimator lens, its position accuracy in the tray may not be guaranteed. Therefore, the clamping of the lens by the coupling fixture will also cause inaccurate positioning, resulting in a decrease in coupling accuracy or even coupling failure. improve this

Method used

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  • Micro-lens automatic coupling packaging equipment
  • Micro-lens automatic coupling packaging equipment
  • Micro-lens automatic coupling packaging equipment

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Embodiment Construction

[0026] In order to make the technical problems, technical solutions and advantages to be solved by the present invention clearer, the following will describe in detail with reference to the drawings and specific embodiments. Apparently, the described embodiments are some, but not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention. In addition, the technical features involved in the different embodiments of the present invention described below may be combined with each other as long as there is no conflict with each other.

[0027] In the description of the present invention, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" etc. The indicated orientation or positional relationship is based on the orientati...

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Abstract

The invention provides a micro-lens automatic coupling packaging device which comprises a lens loading assembly, a lens clamp assembly, a device clamping assembly, a dispensing curing assembly and a visual detection assembly. The lens loading assembly comprises a material disc and a transfer table arranged on one side of the material disc, the material disc is used for loading a micro-lens, the transfer table is used for temporarily bearing a micro-lens to be coupled, the device clamping assembly is used for clamping and positioning an optical device, the lens clamp assembly is used for clamping and placing the micro-lens in the material disc on the transfer table, and then the micro-lens on the transfer table is clamped again and moved to a coupling position of the optical device to complete coupling. The relative position of the micro-lens and the clamping part of the lens clamp assembly is ensured to be accurate so that the micro-lens is accurately positioned by the lens clamp assembly, the position deviation generated by material taking of the lens clamp assembly is corrected, and the coupling precision of the micro-lens is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor lasers, in particular to a microlens automatic coupling packaging device. Background technique [0002] Semiconductor lasers have the characteristics of small size, light weight, high efficiency, and long life. They can be pumped by simply injecting current. Their operating voltage and current are compatible with integrated circuits, so they can be monolithically integrated with them. Direct current modulation with frequencies up to GHz for high-speed modulated laser output. Due to these advantages, semiconductor lasers have been widely used in laser communication, optical storage, optical gyroscope, laser printing, ranging and radar. [0003] With the development of practical engineering, the output power requirements of semiconductor lasers are getting higher and higher. Semiconductor lasers usually have a miniature collimator lens (such as a miniature collimator lens with a width of 0.6...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G02B7/02B25B11/00
CPCG02B7/025G02B7/023B25B11/00
Inventor 段吉安彭晋文唐佳卢胜强徐聪
Owner CENT SOUTH UNIV
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