1results about How to "Improve coupling accuracy" patented technology

This application provides an optical chip, a photoelectric conversion module, and related equipment. The optical chip includes a substrate and an optical device. The process of electrically connecting the optical device to the substrate eliminates the need for solder, avoiding random displacement between the optical device and the substrate caused by solder melting, and improving the mounting accuracy of the optical chip. The substrate includes a convex region and a concave region. The concave region is concave relative to the surface of the convex region. The convex region fixes the light transmission medium. Along a direction perpendicular to the bottom of the concave region, the optical device and the concave region have a first bonding layer formed by thermal bonding. The first bonding layer is used to moltenly bond the optical device to the concave region. The optical device has an optical port, which is aligned with the light transmission medium. The optical device is used to transmit optical signals between the optical port and the light transmission medium.