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Integrated circuit chip packaging equipment

A chip packaging and integrated circuit technology, which is applied in the manufacture of circuits, electrical components, semiconductors/solid devices, etc., can solve problems such as tinning and uneven tin immersion of pins, and achieve the effect of preventing tinning

Inactive Publication Date: 2021-12-03
郑瑞华
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide an integrated circuit chip packaging device, which solves the problems of uneven tin immersion and tin connection on the pins

Method used

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  • Integrated circuit chip packaging equipment

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Embodiment Construction

[0021] combined with Figure 1-5 The integrated circuit chip packaging equipment includes a wrapping mechanism 50, the chip is limited by the limiting mechanism 52, the pins are wrapped by the wrapping mechanism 50, and the molten tin is pressed into the package by the tin spraying mechanism 51. Wrap the cavity of the pins, so that the pins can be evenly contacted with molten tin, and evenly tinned, and can also prevent tin connection between the pins;

[0022] The wrapping mechanism 50 includes a first telescopic cylinder 18 fixed on the base 10, a first piston rod 17 is slidably arranged in the first telescopic cylinder 18, and a first piston rod 17 is fixed on the first piston rod 17. A wrapping block 16, the base 10 is also embedded with a second telescopic cylinder 11, the second telescopic cylinder 11 is slidably provided with a second piston rod 12, and the second piston rod 12 is fixedly provided with a second package Block 13.

[0023] Beneficially, the tin-spraying...

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Abstract

The invention discloses integrated circuit chip packaging equipment which comprises a wrapping mechanism, a chip is limited through a limiting mechanism, pins are wrapped through the wrapping mechanism, and dissolved tin is pressed into a cavity wrapping the pins through a tin spraying mechanism, so that the pins can be in uniform contact with the dissolved tin and can be uniformly tinned, tin connection between the pins can be prevented. The packaging mechanism comprises a first telescopic air cylinder fixed to the base, a first piston rod is arranged in the first telescopic air cylinder in a sliding mode, a first packaging block is fixedly arranged on the first piston rod, and a second telescopic air cylinder is further embedded in the base. The invention can accurately wrap the pin and dip tin after wrapping the pin. According to the tin immersion device, tin connection during tin immersion of the pins can be prevented, the powerful nozzles are arranged in the tin immersion device, the dissolved tin can be sprayed into the wrapping cavity, the pins make uniform contact with the dissolved tin, and therefore the effect of uniform tin immersion is achieved.

Description

technical field [0001] The invention relates to the field of integrated circuit chip packaging, in particular to an integrated circuit chip packaging device. Background technique [0002] Integrated circuit chip packaging refers to connecting the circuit pins on the silicon chip to the external joints with wires so as to connect with other devices. Package form refers to the housing used to install semiconductor integrated circuit chips. It not only plays the role of installing, fixing, sealing, protecting the chip and enhancing the electrothermal performance, but also connects the contacts on the chip to the pins of the package shell with wires, and these pins are soldered to the circuit board. In order to realize the connection between the internal chip and the external circuit, it is necessary to dip tin on the pins during packaging. At present, the tin dipping machines in small factories cannot make the pins soak in tin evenly, and it is possible to connect the pins to ...

Claims

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Application Information

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IPC IPC(8): H01L21/67
CPCH01L21/67144H01L21/6715
Inventor 郑瑞华
Owner 郑瑞华
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