Heat treatment equipment for welding printed circuit board
A technology for printed circuit boards and heat treatment equipment, which is applied in the secondary processing of printed circuits, printed circuits, and printed circuit manufacturing. efficiency, increased versatility, and easy disassembly
Pending Publication Date: 2021-12-03
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Problems solved by technology
[0004] 1. In practical applications, electronic components are usually welded on the circuit board, often because there is a lot of dust on the surface of the circuit board, even if the electronic components are welded on the circuit board during the welding process, it will also be caused by the dust on the surface of the circuit board. The electronic components and the circuit board have virtual welding, so that the electronic components cannot form a circuit path after the circuit board is powered on, making it difficult to maintain
[0005] 2. Due to the needs of practical applications, the circuit board cannot be made into a uniform size and shape of the circuit board, so when cleaning the dust on the surface of the circuit board, the general circuit board clamp cannot be applied to most of the circuit boards on the market, resulting in poor versatility
Method used
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[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
[0029] Such as Figure 1-Figure 5 As shown, a heat treatment equipment for printed circuit board welding includes a support frame 1 and a screw rod lifting mechanism. A sleeve 7 is fixed at the center of the outer surface of the top end of the support frame 1, and a sliding rod 5 runs through the sleeve 7. The sliding rod The lower end of 5 is fixed with printed circuit board by fixing clip 9; , the second hole 85 and the second brush 83, the inside of the cl...
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The invention relates to the technical field of heat treatment for circuit board welding, in particular to heat treatment equipment for welding a printed circuit board. The heat treatment equipment comprises a support frame and a lead screw lifting mechanism, wherein a sleeve is fixed in the center of the outer surface of the top end of the support frame, a sliding rod movably penetrates through the sleeve, and a printed circuit board is fixed at the lower end of the sliding rod through a fixing clamp; and a cleaning shell is fixed to the lifting end of the lead screw lifting mechanism, a first brush, a first hole, a second hole and a second brush are sequentially arranged / formed on / in the inner wall of the cleaning shell from top to bottom, an air suction pump is arranged in the cleaning shell, the air suction end of the air suction pump is connected with an air filter, and the air outlet end of the air suction pump is connected to the first hole or the second hole. According to the heat treatment equipment, dust on the surface of the printed circuit board is cleaned by the cleaning shell, so that the next printed circuit board needing to be welded is easy to weld and is not prone to generate pseudo soldering, and the success rate of welding the printed circuit board is increased.
Description
technical field [0001] The invention relates to the technical field of heat treatment for circuit board welding, in particular to heat treatment equipment for printed circuit board welding. Background technique [0002] The printed circuit board is the provider of the electrical connection of electronic components. Its design is mainly the layout design. The main advantage of using the circuit board is to greatly reduce the errors of wiring and assembly, and improve the level of automation and production labor rate. In practical applications, it is The electronic components are soldered to the circuit board by soldering. [0003] There are at least the following problems in the prior art that have not been resolved: [0004] 1. In practical applications, electronic components are usually welded on the circuit board, often because there is a lot of dust on the surface of the circuit board, even if the electronic components are welded on the circuit board during the welding p...
Claims
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Patent Timeline
Login to View More IPC IPC(8): H05K3/00H05K3/26H05K3/34
CPCH05K3/0008H05K3/26H05K3/34
Inventor 罗顺王雪克
Owner 罗顺