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Packaging method

A technology for substrates and products, applied in the field of packaging technology, can solve the problems of low process accuracy, difficult to guarantee performance such as consistency, and large product processing errors.

Pending Publication Date: 2021-12-07
SHENZHEN YSPRING TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] Due to the low precision of the processing technology such as patch welding, the traditional integration scheme will lead to large product processing errors. In addition, it is difficult to guarantee the consistency and other performance; in addition to the patch method, there are also some optoelectronic modules, but the optoelectronic modules are only On the basis of the patch method, the solution integration is carried out on the PCB (Printed Circuit Board, printed circuit board) board, which only reduces the development difficulty of the user, but does not significantly improve its consistency and other performance

Method used

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Experimental program
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Effect test

Embodiment

[0050] The first embodiment of the present invention discloses a method of packaging, such as figure 1 As shown, including the following steps:

[0051] Step S101, the crystal element 700 to be packaged is fixed to the front surface of the substrate 100 by the silver gel;

[0052] Specifically, the silver glue has a thermally conductive property that can serve as a crystal element 700 for heat dissipation and fixing characteristics, thereby particularly suitable for fixing the crystal element 700 in the front side of the substrate 100 (eg figure 2 , image 3 as well as Figure 4 The effect shown) is.

[0053] In addition, the crystal element 700 to be encapsulated can be one (eg Figure 4 Disted) or more, specifically, for example, 2 crystal elements 700 (eg figure 2 as well as image 3 As shown,, for example, crystal element 700 can include: photoelectric sensor 500 and MCU 600 (where the MCU is MicroController Unit, microcontrollers); wherein the MCU 600 is called a single chip micr...

Embodiment 2

[0085] In order to further explain the present invention, the second embodiment of the present invention also discloses a packaging method in a particular application scenario, which includes the following specific embodiments:

[0086] Step 1, Solid crystal: Secure the photoelectric sensor 500 and the MCU 600 to the substrate 100 via silver gum, the silver glue has a thermally conductive property, which can function as a heat dissipation and fixed characteristics of the photoelectric sensor 500 and the MCU 600, where the substrate 100 is made of multiple independence. The module is made up.

[0087] Step 2, binding: there is bare copper, copper foil trace 300, and pin 400 on the substrate 100, wherein the bare copper is electrically connected by the copper foil trace 300 and the corresponding pin 400, and under the premise of completion of the solid crystal, The PAD on the crystal element 700 of the photoelectric sensor 500 and the MCU 600 is electrically connected to the corresp...

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Abstract

The embodiment of the invention discloses a packaging method. The packaging method comprises the following steps: fixing a wafer to be packaged on the front surface of a substrate through elargol; connecting a bonding pad of the fixed wafer with a bare copper point on the front surface of the substrate; connecting the bare copper points on the front surface of the substrate with the pins on the bottom surface of the substrate; placing the substrate in a cofferdam jig, and pouring light filtering glue into the cofferdam jig so as to cover the wafer; after the light filtering glue is leveled, baking and curing the light filtering glue on the substrate; cutting the cured substrate to obtain a plurality of packaged products, and completing the packaging. According to the scheme, the packaging technology is adopted, and the processing procedure precision of the packaging technology is high, so the consistency of products obtained through the scheme is very good.

Description

Technical field [0001] The present invention relates to the field of packaging processes, and more particularly to a method of packaging. Background technique [0002] At present, the conventional photoelectron system requires two or more chip components. With the growing development of electronic technology, the requirements for integratedization are also increasing, so they produce SOC (System on Chip), system-level chips, it Integrating the required modules is an integrated circuit with a dedicated target. [0003] Traditional integrated schemes are low in processing process processes such as patch welding, which can lead to large product processing errors, in addition, consistency and other performance; in addition to the patch method, there are some photovoltaic modules, but the photovoltaic module is only The scheme is integrated on the PCB (Print Circuit Board, the Printing Circuit Board) on the basis of the patch method, but it is not significantly improved to the perform...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56H01L23/31H01L23/495
CPCH01L23/3121H01L23/49565H01L21/56
Inventor 赵章博庄腾飞
Owner SHENZHEN YSPRING TECH