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Circuit board and welding assembly

A circuit board and welding connection technology, which is applied in the direction of electrical components, printed circuits, printed circuit manufacturing, etc., can solve problems affecting welding yield, achieve the effect of improving welding yield and avoiding welding defects

Pending Publication Date: 2021-12-07
LEDMAN OPTOELECTRONIC HZ CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, for the soldered assembly formed by welding traditional components and circuit boards, when wave soldering is used for soldering, solder will be connected between two adjacent pads of the circuit board. Since the solder is usually made of tin, the pads There is a "connected tin" defect due to the connection of solder, which will affect the soldering yield

Method used

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  • Circuit board and welding assembly
  • Circuit board and welding assembly
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Embodiment Construction

[0022] In order to facilitate the understanding of the present invention, the present invention will be described more fully below with reference to the associated drawings. Preferred embodiments of the invention are shown in the accompanying drawings. However, the present invention can be embodied in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the present invention more thorough and comprehensive.

[0023] It should be noted that when an element is referred to as being “fixed” to another element, it can be directly on the other element or there can also be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or intervening elements may also be present. The terms "inner", "outer", "left", "right" and similar expressions are used herein for the purpose of descripti...

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Abstract

The invention relates to a circuit board and a welding assembly, the circuit board is used for being in welding connection with a component with a pin header, the circuit board comprises a substrate and a bonding pad, the bonding pad is arranged in the substrate in a penetrating mode, the bonding pad is provided with a through hole, and the through hole is used for being matched with the pin header. The through hole penetrates through the bonding pad along the thickness direction of the substrate, and the caliber of the through hole is 0.5 mm to 0.8 mm. As the pin header is matched with the through hole in the bonding pad, the caliber of the through hole is set between 0.5 mm and 0.8 mm, so that the caliber of the through hole can be reasonably reduced, the liquid solder can be gathered near the through hole and prevented from flowing between the two adjacent bonding pads to form a 'tin connection' phenomenon, the welding defect is avoided, and the welding yield of the circuit board and the whole welding assembly is improved. The welding assembly is prevented from being maintained due to elimination of welding defects, the production efficiency of the welding assembly is further improved, and the manufacturing cost of the welding assembly is reduced.

Description

technical field [0001] The invention relates to the technical field of welding, in particular to a circuit board and a welding assembly. Background technique [0002] For the wave soldering process, the solid solder is usually melted to form liquid solder, and the liquid solder is stored in the solder tank. With the help of the action of the pump, the liquid level of the liquid solder in the solder tank forms a solder wave peak of a specific shape, and the element is inserted. The circuit board of the device is placed on the conveyor chain, so that the circuit board passes through the solder wave crest at a specific angle and a specific immersion depth, thereby realizing the soldering of the component and the circuit board. Wave soldering significantly shortens the contact time between the solder and the circuit board and improves the welding efficiency; at the same time, a large amount of liquid solder is in a flowing state, so that the circuit board can fully contact the s...

Claims

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Application Information

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IPC IPC(8): H05K3/32
CPCH05K3/328
Inventor 李漫铁肖露陈智健林志斌
Owner LEDMAN OPTOELECTRONIC HZ CO LTD
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