Semi-conductor encapsulation connecting construction avoiding welding defect induced by warp of substrate

Abstract

The invention relates to a semiconductor packaging and jointing structure, in particular to a semiconductor packaging and jointing structure for preventing welding defects caused by substrate warping, which mainly comprises at least a semiconductor packaging component, a package carrier and a solder. The solder is used for welding external terminals of the semiconductor packaging component to the package carrier. The external terminals of the semiconductor packaging component are at least divided into two groups according to different distances from the substrate centerline. In one embodiment, the external terminals of different groups contain bumps with different heights, the bumps are used for compensating solder clearance difference between connection end points of the external terminals and the package carrier caused by a preset warpage of the substrate, and the welding defects can not occur under the situation that the warpage of the substrate is predictable. In another embodiment, a compensation bump can be arranged between larger solder clearances. The semiconductor packaging and jointing structure can shorten the solder clearance difference caused under a predictable warpage of the substrate, can prevent the welding defects caused by substrate warping; and can integrate the functions of heat radiation and micro distance maintenance.

Description

technical field [0001] The present invention relates to a semiconductor package assembly and bonding technology, in particular to a semiconductor package bonding structure that avoids soldering defects caused by substrate warpage, and can be applied to a high-density 3D stacking structure (Package-On-Package module, POP ). Background technique [0002] With the current development trend of thinning semiconductor packages, the substrate of the semiconductor package becomes more likely to warp during the surface bonding reflow process, resulting in soldering defects such as cold soldering, empty soldering or false soldering. Especially in a package-on-package device (POP) of stacked semiconductor packages, soldering defects are a major problem in the bonding process. In order to meet the needs of advanced miniaturized electronic products, multiple semiconductor packages can be stacked vertically in 3D to meet the requirements of small surface bonding area and high-density com...

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Problems solved by technology

[0009] In view of the defects in the above-mentioned existing semiconductor package joint structure, the inventors actively research and innovate based on years of rich practical experience and professional knowledge in the design and manufacture of such products, and in conjunction with the application of academic theories, in order to create a way to avoid The semiconductor package bonding structure for soldering defects caused by substrate warping can improve the general existing semiconductor package bonding structure and make it more practical

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