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Electrode paste, and electrode thick film and preparation method thereof

A technology of electrodes and pastes, applied in cable/conductor manufacturing, equipment for manufacturing conductive/semiconductive layers, conductive materials dispersed in non-conductive inorganic materials, etc., can solve the test of adhesion and sulfuration resistance The result is not as expected, the high-frequency conductivity is not as expected, and the price is expensive, etc., to achieve the effect of excellent sintering adhesion

Pending Publication Date: 2021-12-10
SYNERGY TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Among them, although aluminum metal has good chemical stability, when it is used as an electrode, its adhesion to the substrate and the test results of sulfuration resistance are not as expected.
However, when copper or nickel metal is used as an electrode, sintering must be carried out in a low-oxygen state due to stability problems. Most of the current solutions use glass powder doped with rare earth metals, which is expensive and high-frequency conductive. not as expected

Method used

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  • Electrode paste, and electrode thick film and preparation method thereof
  • Electrode paste, and electrode thick film and preparation method thereof
  • Electrode paste, and electrode thick film and preparation method thereof

Examples

Experimental program
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Effect test

Embodiment 1

[0030] The preparation of embodiment 1 electrode paste

[0031] First, take Li 2 O, ZnO, Al 2 o 3 、Na 2 O, SrO, V 2 o 5 , B 2 o 3 , SiO 2 Powder, based on the total weight, stirred and mixed according to the following ratio: 0.5-5wt% Li 2 O, 20-50wt% ZnO, 1-5wt% Al 2 o 3 , 1~10wt% Na 2 O, 0.5-5wt% SrO, 1-15wt% V 2 o 5 , 20-50wt% B 2 o 3 , and 1-10wt% SiO 2 .

[0032] The above-mentioned powder is put into the crucible carrier after stirring and mixing, and the powder and the crucible carrier are heated to 1000-1500°C in a resistance furnace for melting for 2 to 4 hours, and then quickly poured into deionized water for extraction to obtain a block of molten glass. Next, the molten glass block is ground for about 24 hours with a coarse grinder, fine grinder, bead mill, etc., to form a powdered glass composition with an average particle size of 1-5 μm, and has a glass softening temperature of 400-900 ° C. point. The so-called average particle size here refers ...

Embodiment 2

[0041] The preparation of embodiment 2 electrode thick film

[0042] Firstly, a ceramic substrate is provided, and the ceramic substrate is obtained by pressing the stacked dielectric sheets and then sintering the dielectric sheets.

[0043] Apply the above-mentioned electrode paste on the end face of the ceramic substrate, then put the ceramic substrate coated with the electrode paste into the electric furnace, and carry out the sintering procedure at a temperature of 850-900°C in an inert gas environment , through the sintering process, the metal powder in the electrode paste will be sintered with each other, and at the same time, the organic binder, solvent and other components in the electrode paste will be burned off, and then a thick electrode film with a conductive pattern will be obtained. The formed electrode The thick film has extremely high electrical conductivity and is excellent in electromigration resistance, solder heat resistance, and adhesion to ceramic substr...

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Abstract

The invention relates to the technical field of electrode paste materials, in particular to an electrode paste, and an electrode thick film and a preparation method thereof. The electrode paste comprises 70-90 wt% of metal powder, 1-8 wt% of glass composition, 5-30 wt% of an organic binder and 2-30 wt% of a solvent, wherein the glass composition is Li2O-ZnO-Al2O3-Na2O-SrO-V2O5-B2O3-SiO2. The electrode paste is sintered in a low-temperature environment, and the prepared electrode thick film has excellent electrical performance.

Description

technical field [0001] The invention relates to the technical field of electrode paste materials, and specifically relates to an electrode paste body, an electrode thick film and a preparation method thereof. Background technique [0002] In today's electronic products, resistors are one of the most widely used passive components, and their applications include high-frequency chip resistors, automotive electronics, consumer electronics, and home appliances. Among them, the common thick film chip resistors are printed by thick film process. This kind of resistors have various shapes and are mainly used in power resistors and precision resistors. [0003] In the conductive paste production technology of thick film chip resistors, the conductive metal powder is mostly precious metal powder such as gold or silver, especially silver powder is the most widely used. However, in addition to its high cost, when silver metal is used as the material of conductive paste and applied to ...

Claims

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Application Information

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IPC IPC(8): H01B1/16H01B1/22H01B5/14H01B13/00
CPCH01B1/16H01B1/22H01B5/14H01B13/0026
Inventor 金雷李向榮孔維彬魏玲
Owner SYNERGY TECH