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Plasma source coil with changeable structure and adjusting method thereof

A plasma source and plasma technology, applied in plasma, semiconductor/solid-state device manufacturing, discharge tube, etc., can solve the problems of not disclosing the structure of the plasma source coil and achieve the effect of ensuring uniformity

Pending Publication Date: 2021-12-10
ADAPTIVE PLASMA TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the miniaturization and advancement of the semiconductor process, ensuring the uniformity of the process results has become a major issue (issue), but the prior art does not disclose the plasma source coil that ensures uniformity in various processes. structure

Method used

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  • Plasma source coil with changeable structure and adjusting method thereof
  • Plasma source coil with changeable structure and adjusting method thereof
  • Plasma source coil with changeable structure and adjusting method thereof

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Embodiment Construction

[0032] Hereinafter, the present invention will be described in detail with reference to the embodiments shown in the drawings, but the embodiments are for clearly understanding the present invention, and the present invention is not limited to the embodiments. It should be understood that in the following description, components with the same reference numerals in different figures have similar functions, so if it is not necessary to understand the present invention, repeated description will not be given, and known components will be briefly described or omitted, but not excluded from the embodiments of the present invention.

[0033] Figure 1a and Figure 1b is a diagram of an embodiment of a variable configuration plasma source coil 10 according to the present invention.

[0034] refer to Figure 1a The variable-structure plasma source coil 10 includes a plurality of coil branches 11_1 to 12_M extending in a helical shape based on the central portion CP, and the extension...

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Abstract

The invention relates to a plasma source coil with a changeable structure and an adjusting method thereof. The plasma source coil with the variable structure includes a plurality of coil branches (11_1 to 12_M) extending in a spiral shape based on a central part (CP), and an extension direction or an inclination in the extension direction of at least one of the coil branches (11_1 to 12_M) may be adjusted.

Description

technical field [0001] The invention relates to a structure-changeable plasma source coil and an adjustment method thereof, in particular to a structure-changeable plasma source coil capable of inducing uniform flow of plasma on the entire wafer surface and an adjustment method thereof. Background technique [0002] The source coil (Source Coil) that generates plasma in semiconductor manufacturing equipment that uses plasma (Plasma) for etching (Etching) process is one of the main devices that affect the plasma density and uniformity. Plasma density and uniformity are major factors in determining the speed of the etching process and the uniform nature of the resultant, but it is difficult to ensure uniformity of plasma distribution across the wafer surface under a variety of process conditions. Various techniques for adjusting the generation characteristics of plasma are known in the art. Patent No. 10-0519677 discloses a method for manufacturing a plasma coil with high rel...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01J37/32H05H1/46H01L21/67
CPCH01J37/321H01J37/3211H05H1/46H01L21/67069H01J2237/334
Inventor 催佑荧李相雨
Owner ADAPTIVE PLASMA TECH