Chip frame fixing support of semiconductor chip wire bonding equipment

Abstract

The invention discloses a chip frame fixing support of semiconductor chip wire bonding equipment, and the support comprises a pressing plate mechanism which is provided with a liftable pressing plate and an elastic pressing claw installed on the pressing plate, wherein the elastic pressing claw tightly presses a chip frame when the pressing plate descends; a central rail module, wherein the upper part of the central rail module is provided with a rail for the sliding of the chip frame, and the side part of the rail is provided with a concave step for the insertion of the telescopic insertion sheet; telescopic insertion pieces which are located on the two sides of the center rail, wherein the insertion pieces are driven to clamp the chip frame from the side direction when the pressing plate descends; a plurality of positioning pins which are used for jointing and positioning the pressing plate, the chip frame and the central track when the pressing plate descends; and a driving mechanism which is connected with the power source and the pressing plate and can drive the pressing plate to ascend and descend and can fix all parts of the chip frame, so that the problems of poor welding spots and the like caused by vibration of the chip frame in the wire welding process are solved.

Description

technical field [0001] The invention relates to semiconductor chip packaging equipment, in particular to a chip frame fixing bracket used in semiconductor chip wire bonding equipment. Background technique [0002] The wire bonding process is a key production link in the semiconductor packaging process. In the process of wire bonding, it is necessary to use wires to weld the chip and frame pins together, use ultrasonic waves or heating blocks for wire bonding, use a pressure plate to press and fix the frame, and then perform wire bonding. However, during the wire welding process, the frame will shake and shift, and there will be problems such as false welding of solder joints, poor solder joints, and failure to press, resulting in a high defect rate in the production process. [0003] CN112108827A discloses a pressing plate device, which includes a pressing plate frame capable of pressing the product to be welded. The pressing plate frame is provided with an operation window...

AI Technical Summary

Problems solved by technology

However, during the wire welding process, the frame will shake and shift, and there will be problems such as false welding of solder joints, poor solder joints, and failure to press, resulting in a high defect rate in the production process

[0003] CN112108827A discloses a pressing plate device, which includes a pressing plate frame capable of pressing the product to be welded. The pressing plate frame is provided with an operation window capable of exposing the welding area of ​​the product to be welded. The first auxiliary platen assembly located in the operation window to be pressed by the area to be welded solves the problem of high product scrap rate to a certain extent, but because the overall chip frame is uneven rather than a flat plate, the chip frame cannot be avoided during the wire bonding process. Problems with warping or vibration, product scrap rate is still high

However, the problem of chip frame warping or vibration during the wire bonding process cannot be avoided, and the product scrap rate is still high

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