Processing method of ceramic dielectric window for plasma etching machine

Abstract

The invention discloses a processing method of a ceramic dielectric window for a plasma etching machine, and aims to overcome the defects that the ceramic dielectric window is low in processing efficiency, high in production cost and easy to deform in a sintering process. The method comprises the steps of a, filling ceramic powder into a cold isostatic pressing forming mold; b, putting the cold isostatic pressing forming mold filled with the ceramic powder into a cold isostatic pressing container, pressurizing the cold isostatic pressing forming mold by adopting a cold isostatic pressing cylinder, and maintaining the pressure; c, taking out the cold isostatic pressing forming mold, demolding and taking out a ceramic dielectric window green body; d, grinding the outer contour of the ceramic dielectric window green body; e, putting the ceramic dielectric window green body subjected to outer contour grinding into a sintering furnace to be sintered, arranging a supporting table in the sintering furnace, arranging a plurality of supporting convex rings on the supporting table, supporting the ceramic dielectric window green body on the supporting convex rings with the opening facing upwards, and loading sintering sand in the sintering furnace; and f, after sintering is completed, taking out the sintered ceramic dielectric window.

Description

technical field [0001] The invention relates to the field of ceramic processing, more specifically, it relates to a method for processing a ceramic dielectric window for a plasma etching machine. Background technique [0002] At present, plasma etching machine equipment mainly includes four parts: pre-vacuum chamber, etching chamber, gas supply system and vacuum system. The main components of the etching chamber are: plasma coupling coil, ceramic dielectric window, ICP radio frequency unit, RF radio frequency unit, lower electrode system, temperature control system, etc. The ceramic dielectric window is located between the chamber and the plasma coupling coil, which can seal the vacuum without affecting the passage of the plasma into the chamber. [0003] The semiconductor industry has a complex industrial chain. From upstream to downstream, there are industries such as materials and equipment, chip design, chip manufacturing, and chip product packaging and testing. In the...

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Problems solved by technology

[0004] Most of the ceramic dielectric windows are large-sized hemispherical. The traditional manufacturing process uses the ceramic green material with a relatively large amount of sintering first, and then finishes the dimensional characteristics of the ceramic dielectric window after the material is sintered. The production cost of this processing method is relatively high. Low production efficiency

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