RRAM heat dissipation device with packaging piece filled with environment-friendly gas for cooling
A heat dissipation device and package technology, which is applied in the direction of electrical components, electrical equipment structural parts, cooling/ventilation/heating transformation, etc., can solve the problems of low heat dissipation efficiency of heat dissipation devices, achieve small space occupation, prolong life, and reduce size Effect
Pending Publication Date: 2021-12-17
XIAN UNIV OF TECH
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Problems solved by technology
[0004] The purpose of the present invention is to provide an RRAM cooling device filled with environmentally friendly gas to cool down the package, so as to solve the problem of low heat dissipation efficiency of existing cooling devices
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[0024] The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments.
[0025] The present invention is an RRAM cooling device filled with environment-friendly gas to cool the package, the structure is as follows figure 1 As shown, including the shell 1, the shell 1 is made of a heat dissipation plate material, the chip area 2 is arranged inside the shell 1, and the rest of the area is a cooling and heat dissipation area. The plates are separated, and the cooling and heat dissipation area includes an evaporator assembly 6 and a condenser assembly 9 arranged in sequence from top to bottom on one side of the chip area 2. The evaporator assembly 6 communicates with the condenser assembly 9, and the evaporator assembly 6 communicates with the chip area. 2 communicates with each other, and a ventilation channel 23 is provided under the chip area 2, one end of the ventilation channel 23 communicates with the condenser ...
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The invention discloses an RRAM heat dissipation device with a packaging piece filled with environment-friendly gas for cooling. The RRAM heat dissipation device comprises a shell, wherein a chip area is arranged in the shell, one side of the chip area is sequentially provided with an evaporator assembly and a condenser assembly from top to bottom, the evaporator assembly is communicated with the condenser assembly, the evaporator assembly is communicated with the chip area, a ventilation channel is arranged below the chip area, one end of the ventilation channel is communicated with the condenser assembly, and the other end of the ventilation channel is communicated with the outside through the side wall of the shell. The heat dissipation device solves the problem that an existing heat dissipation device is low in heat dissipation efficiency.
Description
technical field [0001] The invention belongs to the technical field of heat dissipation of RRAM electronic chips, and relates to an RRAM heat dissipation device in which an environment-friendly gas is filled in a package for cooling. Background technique [0002] In the composition structure of the computer, there is a very important part RRAM (resistive random access memory). RRAM is a rewritable memory technology that can significantly improve the operating durability and data transfer speed of chip systems. It is a method that changes the resistance of the material between the high resistance state and the low resistance state according to the voltage applied to the metal oxide, thereby opening or blocking the current flow channel, and using this property to store various information memory. However, the process of changing back and forth between the high-resistance state and the low-resistance state of the resistive random access memory and the process of data transmis...
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IPC IPC(8): H05K7/20
CPCH05K7/208H05K7/20718
Inventor 张嘉伟刘朝辉文森特·霍伊维兰宋宸陈俊辉王力付钰伟秦司晨
Owner XIAN UNIV OF TECH