Welding method for realizing high-temperature-resistant metal shell

Abstract

The invention discloses a welding method for realizing a high-temperature-resistant metal shell. The method comprises the following steps that the first step, after electroplating of bottom nickel on a metal cap body made of a 4J29 material is conducted, electroplating of gold on the surface is conducted, the size of a cap opening is 15mm*20mm, zinc selenide is selected as the material of a light window, the size of the light window is 14.9mm*19.9mm, the edge of the light window is subjected to metallization treatment, a surface welding layer of the light window is a gold layer, and the size of an InSn48 preformed welding piece is determined according to the length and the width of the cap opening, the width of a metallization layer of a light window piece and the welding volume needing to be filled; and the second step, an experimental instrument is prepared, the experimental instrument adopts a vacuum brazing furnace to replace a chain type mesh belt furnace used by traditional brazing, and the vacuum furnace has the advantages of being accurate in temperature control, controllable in furnace atmosphere and vacuum degree and easy and convenient to operate. According to the method, due to an arranged metal limiting block, the position of the zinc selenide light window in the metal cap body can be conveniently fixed through the metal limiting block.

Description

technical field [0001] The invention belongs to the technical field of chip packaging, and in particular relates to a welding method for realizing a high-temperature-resistant metal casing. Background technique [0002] The shell used to install the semiconductor integrated circuit chip plays the role of placing, fixing, sealing, protecting the chip and enhancing the electrothermal performance, and it is also a bridge to communicate the internal world of the chip and the external circuit; the contacts on the chip are connected to the leads of the package shell with wires These pins are connected to other devices through wires on the printed board; therefore, packaging plays an important role in both CPUs and other LSI integrated circuits. [0003] Usually when the chip is packaged, the zinc selenide or sapphire light window on the chip shell and the metal can not achieve good results through conventional brazing technology. After the conventional welding technology is welded...

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is to overcome the existing defects and provide a welding method for realizing high-temperature-resistant metal shells, so as to solve the problem of zinc selenide or The effect of the sapphire light window and metal through conventional brazing technology is not good. After the conventional welding technology is welded, the chip can only withstand high temperatures below 400 degrees. When the temperature reaches above 400 degrees, the light window will be in contact with the metal. Separation, causing the problem that the chip cannot be used

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