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Material bonding method and device

A material bonding and heating device technology, applied in the direction of material gluing, adhesive heating bonding method, connecting components, etc., can solve problems such as uneven heating

Inactive Publication Date: 2021-12-21
深圳市德龙智能高科技有限公司
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  • Abstract
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  • Application Information

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Problems solved by technology

[0007] Aiming at the above problem of uneven heating, the present invention proposes a material bonding method and device that can be locally heated without causing gasification

Method used

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Embodiment Construction

[0020] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention more clear, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0021] like figure 1 As shown, a material bonding method is proposed, which includes:

[0022] Step 102, setting the first material and the second material to be bonded on a platform, the first material and the second material forming a bonding gap, and setting glue for bonding in the bonding gap.

[0023] Wherein, the first...

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Abstract

The invention provides a material bonding method which comprises the steps that a first material to be bonded and a second material to be bonded are arranged on a platform, a bonding gap is formed by the first material and the second material, and glue for bonding is arranged in the bonding gap; and a heating device is arranged and comprises a heat source, a focusing lens and a heat transfer medium. Heat emitted by the heat source is focused through a focusing lens to act on a heat transfer medium, and glue is heated through the heat transfer medium. According to the method, the problem of gasification of the glue or the to-be-glued material is avoided, and the temperature is more controllable and uniform. In addition, the invention further provides a material bonding device.

Description

technical field [0001] The invention belongs to the field of laser processing, in particular to a material bonding method and device. Background technique [0002] Object bonding, it is simply to realize by the pulling force between the polymer body in glue. In glue, water is exactly the carrier of polymer body, and water loads polymer body and is immersed slowly in the tissue of object. After the moisture in the glue disappeared, the polymer body in the glue just relied on mutual pulling force, with two objects combining tightly. Therefore, the method of glue bonding materials is to remove the moisture in the glue, and the polymer in the remaining glue binds the materials. [0003] At present, glue curing methods include: natural curing at room temperature, heat curing, UV ultraviolet curing, etc. [0004] In a natural environment at room temperature, after several hours, the water molecules in the glue will slowly evaporate; or put the product in a hot stove environment...

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J5/06F16B11/00
CPCC09J5/06F16B11/006
Inventor 张培荣杨锦彬赵振宇张红兵岳武陈文运农光成谭小勇杨杰旭
Owner 深圳市德龙智能高科技有限公司
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