Printed circuit board whole board electric gold and partial thickening gold manufacturing method and printed circuit board

Abstract

The production method of the whole printed circuit board electric gold and then partially thickening the gold and the printed circuit board, the method includes: material cutting, drilling, copper sinking, and whole board electroplating; paste anti-plating dry film on both sides of the circuit board, expose and develop, Expose the circuit area that needs electro-gold; conduct graphic copper plating, thicken the exposed circuit to the predetermined copper thickness; perform electro-gold surface treatment, electroplate the thickened circuit surface with a nickel layer and then electroplate a thin gold layer; dry film recede; silk screen photosensitive wet film is filled in the line gap thickened by graphic electroplating; wet film is dried after silk screen printing wet film; anti-plating dry film is pasted on the surface of the wet film, and the area that needs to be thickened with gold is exposed after exposure and development; Electroplate thick gold in the area; remove the dry film and wet film, etch with alkaline etching solution to obtain the required circuit pattern and electro-gold layer; normally carry out solder mask and subsequent processes. It solves the problem in the prior art that the second dry film application makes the first dry film hard and brittle, so that it cannot be adhered to the board surface, resulting in the problem of gold penetration in the process of electroplating thick gold.

Description

technical field [0001] The invention relates to the field of circuit boards, in particular to a method for manufacturing a printed circuit board with electro-gold on the entire board and then partially thickening the gold, and the printed circuit board. Background technique [0002] With the continuous upgrading of electronic equipment, the performance requirements for printed circuit boards are also getting higher and higher. Therefore, in order to meet the various electrical performance requirements of the PCB board, there has been a design requirement for the entire printed circuit board to be plated with thin gold and then partially plated with thick gold. The advantage of this design is that the thin gold-plated area can be used for soldering, and the thick gold area can be used for bonding or plugging, and the entire board electro-gold process does not require additional leads. [0003] The current process of electroplating the entire board and then electroplating thi...

AI Technical Summary

Problems solved by technology

[0005] The present application aims at the above-mentioned defects in the prior art, and in order to solve the problem that the second dry film is applied so that the first dry film becomes hard and brittle so that it cannot be attached to the board surface, resulting in gold infiltration during the process of electroplating thick gold, the present invention Propose a kind of printed circuit board electric gold of the whole board and then partially thicken the gold production method and printed circuit board

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