Substrate structure with heat dissipation structure and manufacturing method thereof

Abstract

The invention provides a substrate structure with a heat dissipation structure and a manufacturing method thereof. The method includes: sequentially forming a thick line layer-adding structure and a thin line layer-adding structure on the top of the reinforced structure layer. And forming an external circuit layer and a protection layer at the bottom of the reinforced structure layer; and forming a heat dissipation structure in the strengthening structure layer, the thick line layer-adding structure and the thin line layer-adding structure, wherein a plurality of heat dissipation parts of the heat dissipation structure are respectively exposed out of the bottom of the strengthening structure layer and the surface of the thin line layer-adding structure. The thin circuit layer-adding structure is flat and can be directly and electrically connected with at least one chip, and heat energy generated by the chip is dissipated from the heat dissipation part exposed out of the bottom of the strengthening structure layer through the thin circuit layer-adding structure and the thick circuit layer-adding structure through the heat dissipation structure, so that the purpose of improving the heat dissipation effect and the use efficiency is achieved.

Description

technical field [0001] The invention relates to a substrate structure, and in particular to a substrate structure with a heat dissipation structure and a manufacturing method thereof. Background technique [0002] With the rapid development of the electronics industry, many applications in different fields such as the Internet of Things (IoT), 5G mobile communications (5th generation mobile networks, 5th generation wireless systems, 5G), biotechnology, artificial intelligence chip (Artificial intelligence chip) , AI chip) and other related electronic products are developing rapidly. Through the application of these electronic products, related service networks can be connected in series to improve the quality of life and convenience of the people. [0003] These electronic products include a plurality of electronic components, processors, etc., and through the mutual operation of these electronic components and / or processors, the electronic products provide one or more func...

AI Technical Summary

Problems solved by technology

The main reason is that the size of these joints is too small, resulting in the heat generated by energy accumulation cannot be effectively dissipated

As a result, electronic components and processors will easily fail due to excessive temperature.

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