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Simple method for quickly finding MLCC short circuit point

A short-circuit point and simple technology, which is applied in the preparation of test samples, measuring devices, and material analysis through optical means, can solve the problems of poor impedance analysis, time-consuming and labor-intensive problems, and reduce the time to find short-circuit points , the effect of quick search

Inactive Publication Date: 2021-12-28
元六鸿远(苏州)电子科技有限公司
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  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, it is very difficult to analyze the poor impedance of the product. It is necessary to find the bad flash point under a microscope of 1000 times, and it needs to be observed while DPA, which is time-consuming and labor-intensive. Usually, it takes a week to analyze a product.

Method used

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  • Simple method for quickly finding MLCC short circuit point
  • Simple method for quickly finding MLCC short circuit point
  • Simple method for quickly finding MLCC short circuit point

Examples

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Embodiment 1

[0034] see Figure 1-3 , a simple method for quickly finding the short-circuit point of MLCC, including the following steps:

[0035] Step 1 Grinding: Grinding off the end of one side of the ceramic capacitor to expose the ceramic body;

[0036] Wherein, in order to ensure the accuracy and controllability of grinding the end of the capacitor, the grinding method in the first step uses 2400-grit sandpaper for manual grinding, so as not to cause the opposite electrode to be worn.

[0037] Step 2 Circuit connection: Using the principle of electrolysis, immerse the unpolished end of the ceramic capacitor in the watt bath plating solution, connect the polished end to probe 1, connect probe 2 to the watt bath plating solution, and use probe 1 and probe 2 The wires are connected to the DC power supply;

[0038] Wherein, in order to ensure the stability and conductivity of the Watt bath plating solution when energized, the Watt bath plating solution in the step 2 is nickel sulfate 3...

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Abstract

The invention discloses a simple method for quickly finding an MLCC short circuit point. The method comprises the steps of 1, polishing: polishing one side end of a ceramic capacitor body, and exposing the ceramic capacitor body, 2, circuit connection: immersing the unpolished end of the ceramic capacitor in a watt bath plating solution by using an electrolysis principle, connecting the polished end with a probe 1, connecting the watt bath plating solution with a probe 2, and connecting the probe 1 and the probe 2 to a direct-current power supply by using wires, 3, electrolyzing: dissolving the short-circuit layer electrode, 4, microscopic observation: taking down the product, and observing a dissolution layer on a metal microscope, 5, product fixing: fixing the product in acrylic resin, and 6, damage analysis: carrying out destructive physical method analysis on the product, confirming a bad mode, finding out a bad impedance layer, then carrying out DPA analysis, and after DPA, only finding out a bad point in the bad layer under a microscope, so that the time for finding out the bad point is greatly reduced.

Description

technical field [0001] The invention relates to the field of ceramic capacitors, and more specifically, relates to a simple method for quickly finding short-circuit points of MLCCs. Background technique [0002] Chip multi-layer ceramic capacitors (MLCC, Multi-layerCeramicCapacitors) have the characteristics of large capacity, small size, stable capacitance, good high temperature and humidity resistance, and easy surface mounting. They are widely used in high frequency filtering of air conditioners, power back Lotus and bypass circuits. [0003] Destructive physical analysis, abbreviated as DPA, is to randomly select an appropriate number of samples in the production batch of components, and use a series of non-destructive and destructive methods to test whether the design, structure, material, and manufacturing quality of components meet the predetermined requirements. Uses and related specification requirements. [0004] Among them, as the size of MLCC is getting smaller...

Claims

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Application Information

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IPC IPC(8): G01N21/84G01N1/32
CPCG01N21/84G01N1/32
Inventor 钱华
Owner 元六鸿远(苏州)电子科技有限公司
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