Liquid used for chemical tin immersion of 5G signal board

A technology of chemical immersion tin and signal board, which is applied in liquid chemical plating, coating, electrical components, etc., can solve the problems of lack of coating inhibition effect of tin-plating agent, the thickness of deposited tin layer cannot meet the needs of signal board process, etc. The effect of reducing the resistivity of the solvent, reducing the diffusion coefficient of tin ions, and inhibiting the deposition process

Pending Publication Date: 2021-12-31
深圳市中科博美新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The purpose of the present invention is: in order to solve the problem that the tin plating agent lacks the inhibitory effect on the agglomeration phenomenon in the coating fi

Method used

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  • Liquid used for chemical tin immersion of 5G signal board
  • Liquid used for chemical tin immersion of 5G signal board

Examples

Experimental program
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Effect test

Embodiment 1

[0024] The present invention provides a technical solution: A method for chemical-tin plate 5G signal syrup, the syrup composition comprises Immersion Tin with A agent and the B agent pretreatment agent, the agent comprising the following components A mass percent Total: 5% stannous compound, a reducing agent 18%, 18% complexing agent, adding additives 1%, 8% and reducing the balance of water, said agent B comprises the following components in parts by weight: 2% penetrant, 1% of the modifier, and the balance of pure water, the stannous compound is stannous sulfate, the reducing agent is sodium hypophosphite, the complexing agent is citric acid-based agent, said adding additives is a modified cerium chloride solution, and the cerium chloride solution bismuth nano-modified supported by a dipping method, the modifier comprises quercetin and thiourea, and a weight ratio of 2: 3, the permeate nonionic surface active agents include the APG agents, and non-ionic surface active agent mas...

Embodiment 2

[0027] The present invention provides a technical solution: A method for chemical-tin plate 5G signal syrup, the syrup composition comprises Immersion Tin with A agent and the B agent pretreatment agent, the agent comprising the following components A mass percent Total: 8% stannous compound, reductant 23%, 22% complexing agent, adding additives 3%, 9% and reducing the balance of water, said agent B comprises the following components in parts by weight: penetrant 4%, 3%, and the balance modifier of pure water, the stannous compound is stannous chloride, the reducing agent is sodium hypophosphite, the complexing agent is citric acid-based agent, the modifying said adjuvant is added a solution of cerium chloride, cerium chloride solution and nano-bismuth modified supported by a dipping method, the modifier comprises quercetin and thiourea, and a weight ratio of 2: 3, the osmotic agents include nonionic surfactants the APG, and the percentage of non-ionic surfactant is 1% by mass, th...

Embodiment 3

[0029] The present invention provides a technical solution: A method for chemical-tin plate 5G signal syrup, the syrup composition comprises Immersion Tin with A agent and the B agent pretreatment agent, the agent comprising the following components A mass percent Total: 12% stannous compound, reductant 26%, 26% complexing agent, adding additives of 5%, 10% of the reducing agent and the balance water, said agent B comprises the following components in parts by weight: 6% penetrant, 5% of the modifier, and the balance of pure water, the stannous tin compound is a sulfonic acid, sodium hypophosphite as the reducing agent, the complexing agent is citric acid-based agent, said adding additives is a modified cerium chloride solution, and the cerium chloride solution bismuth nano-modified supported by a dipping method, the modifier comprises quercetin and thiourea, and a weight ratio of 2: 3, the permeate nonionic surface active agents include the APG agent, and the percentage of non-io...

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Abstract

The invention discloses a liquid used for chemical tin immersion of a 5G signal board, and belongs to the technical field of chemical tin immersion. A liquid composition comprises an agent A for tin immersion and a pretreatment agent B. In the liquid, cerium chloride and nano bismuth particles can adhere to surface vacancies, dislocation outcrops and grain boundaries of stannous ions, the surface energy of grains can be reduced, and therefore the tin ion replacement reaction is improved, it is guaranteed that the forming rate of a plating layer is increased, cerium chloride and nano bismuth can reduce the resistivity of a solvent, after cerium chloride and nano bismuth are synchronously adsorbed on the surface of a copper base through the replacement reaction, electric conductivity can be improved, meanwhile, a PCB is pre-immersed in the agent B to be pretreated before tin immersion treatment so that APG, quercetin and thiourea can be uniformly dispersed and adsorbed on the surface of the copper base after a nonionic surfactant is used, the surface of the copper base has good wettability, the diffusion coefficient of tin ions is reduced during the replacement reaction, the deposition process is inhibited, crystallization is fine and uniform, electric conductive strength is improved, and the durable life is prolonged.

Description

Technical field [0001] The present invention pertains to chemical-tin technology, and more particularly, to a chemical-tin plate 5G signal for medicine. Background technique [0002] PCB immersion tin process for SMT facilitate chip package specifically designed surfaces of the copper chemically deposited tin metal coating, is substituted a green Pb-Sn alloy coating made of new technology has been widely used in electronic product, hardware, decorations, 5G plate signal can be realized because the circuit board by the more precise chemical-tin tinned, are being widely used; [0003] 5G signal refers to a signal using a fifth-generation mobile communication transmission technology, mobile communication technology is a new generation of broadband high-speed, low latency and high connection characteristics, since 5G signal transmission power is required, and a large low latency connections characteristics of the high physical properties of the signal plate 5G, the conventional signa...

Claims

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Application Information

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IPC IPC(8): C23C18/31C23C18/18H05K3/18
CPCC23C18/1662C23C18/31C23C18/1834H05K3/18
Inventor 杜腾辉谭文灵陈太平
Owner 深圳市中科博美新材料科技有限公司
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