A kind of chip test equipment and test method based on double integrating sphere

Abstract

The invention relates to the technical field of chip testing, in particular to a chip testing device and a testing method based on a double integrating sphere. Including: an automatic supply device, an automatic alignment device, a test device and a storage device arranged in sequence along the chip transmission direction; the test device includes: a turntable with at least two test stations set opposite to each other; a driving structure arranged on one side of the turntable , including a bracket, a drive piece connected to the bracket, and a slide rail slidably connected to the bracket, and two installation stations are arranged side by side on the bracket; the first integrating sphere and the second integrating sphere are respectively arranged on the two installation stations. Under the action of the driving member, the first integrating sphere or the second integrating sphere is aligned with the test station between the two installation stations, and the maximum testable power of the first integrating sphere and the second integrating sphere are different. The chip testing equipment and testing method based on double integrating spheres provided by the invention can simultaneously measure chips with different powers and wavelengths, and the testing efficiency is high.

Description

technical field [0001] The invention relates to the technical field of chip testing, in particular to a chip testing device and a testing method based on a double integrating sphere. Background technique [0002] An integrated circuit (Integrated Circuit, IC), also known as a microchip, chip or chip, is a way to miniaturize circuits (including semiconductor devices, as well as passive components, etc.), and is often manufactured on the surface of semiconductor wafers, widely used In various fields such as mobile terminals, computer equipment, face recognition, smart home, unmanned driving, and aerospace. With the development of the semiconductor industry, the thickness of integrated circuit chips is becoming thinner and thinner, and the processing and detection accuracy of chips is getting higher and higher. For the chip size manufactured by the manufacturer, the most common size is a rectangle. After the existing chip is processed, it needs to be detected by a detection me...

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Problems solved by technology

[0003] Therefore, the technical problem to be solved by the present invention is to overcome the defects that the chip testing device in the prior art cannot measure chips of different powers and wavelengths at the same time, the operation is complicated, and the testing efficiency is low, thereby providing a low-cost, high testing efficiency , convenient and flexible, chip testing equipment and testing methods based on double integrating spheres that can measure chips of different powers and wavelengths arbitrarily

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