A kind of chip test equipment and test method based on double integrating sphere
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HEBEI KTHAHCO TECH CO LTD
- Publication Date
- 2022-02-18
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Abstract
Description
technical field
[0001] The invention relates to the technical field of chip testing, in particular to a chip testing device and a testing method based on a double integrating sphere. Background technique
[0002] An integrated circuit (Integrated Circuit, IC), also known as a microchip, chip or chip, is a way to miniaturize circuits (including semiconductor devices, as well as passive components, etc.), and is often manufactured on the surface of semiconductor wafers, widely used In various fields such as mobile terminals, computer equipment, face recognition, smart home, unmanned driving, and aerospace. With the development of the semiconductor industry, the thickness of integrated circuit chips is becoming thinner and thinner, and the processing and detection accuracy of chips is getting higher and higher. For the chip size manufactured by the manufacturer, the most common size is a rectangle. After the existing chip is processed, it needs to be detected by a detection me...