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Wafer test probe card and wafer test system thereof

A wafer testing and probe card technology, applied in electronic circuit testing, electrical measurement, measuring devices, etc., can solve problems such as probe bending deformation, probe insertion into the wafer, overdrive, etc., to improve accuracy and ensure Accuracy, the effect of reducing the failure rate

Pending Publication Date: 2021-12-31
YANGTZE MEMORY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Among them, during the wafer testing process, due to unskilled or careless engineers, the probe will be overdriven, causing the probe to penetrate the wafer excessively, which will lead to bending deformation of the probe or relatively deep scratches on the surface of the wafer to be tested.

Method used

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  • Wafer test probe card and wafer test system thereof
  • Wafer test probe card and wafer test system thereof
  • Wafer test probe card and wafer test system thereof

Examples

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Embodiment Construction

[0040] Hereinafter, the present invention will be described in more detail with reference to the accompanying drawings. In the various figures, identical elements are indicated with similar reference numerals. For the sake of clarity, various parts in the drawings have not been drawn to scale. Also, some well-known parts may not be shown.

[0041] Wafer testing is a necessary process after wafer manufacturing is completed, to identify whether the quality of the wafer is qualified before packaging, and to evaluate the electrical parameters of its device / circuit. At present, in the process of wafer testing, due to unskilled or careless engineers, the probes may be overdriven so that the probes penetrate the wafer excessively, which will lead to bending deformation of the probes or relatively deep scratches on the surface of the wafer to be tested. The present application provides an improved wafer test probe card and its wafer test system, so as to prevent the probes from exce...

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PUM

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Abstract

The invention discloses a wafer test probe card and a wafer test system thereof, and the wafer test probe card comprises a substrate having the second surface of which faces the to-be-tested surface of a wafer, a probe having one end fixed on the substrate and the other end being a free end used for contacting the to-be-tested surface of the wafer, and at least one alarm device that is mounted on the substrate and outputs an alarm signal when detecting that the first distance is lower than a set threshold value; the alarm device measures the first distance, and the set threshold value is larger than or equal to the minimum safety distance from the substrate to the to-be-tested surface. The alarm signal reminds that the distance between the wafer test probe card and the to-be-tested surface of the wafer is less than the minimum safe distance, thereby preventing the probe and the to-be-tested surface of the wafer from being damaged due to excessive probe insertion, ensuring the accuracy of the wafer test result, and protecting the probe and the to-be-tested surface of the wafer from being damaged.

Description

technical field [0001] The invention relates to the technical field of wafer testing, and more particularly, to a wafer testing probe card and a wafer testing system thereof. Background technique [0002] In the semiconductor device manufacturing process, testing is an important link to ensure the quality of the device. After the wafer fabrication is completed, the process of wafer testing needs to be performed. Wafer testing is chip testing (die sort) or wafer electrical testing (wafer sort). Wafer testing is to perform needle testing on each die on the wafer. A hair-thin probe (probe) made of gold wire is installed on the detection head, and the probe is in contact with the pad in the die. , and then test whether its electrical characteristics are qualified. [0003] During wafer testing, the wafer is placed on the stage opposite to the wafer test probe card in the wafer test system, and is aligned with a very thin probe probe, and the probes are aligned with each of th...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): G01R31/28G01B11/14
CPCG01R31/2886G01R31/2887G01B11/14
Inventor 吴继君
Owner YANGTZE MEMORY TECH CO LTD