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Strip line-based coaxial feed microstrip antenna

A coaxial feed, microstrip antenna technology, applied in the direction of electrical short antenna, antenna, antenna coupling, etc., can solve the problem of antenna radiation characteristic damage, etc., to achieve the effect of improving gain and bandwidth

Pending Publication Date: 2021-12-31
XIDIAN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] According to the conventional antenna design method in the related art, the size of the patch antenna working in the W band is usually in the range of 1-2mm. The influence of scatterers such as components or large-area printed circuit boards causes the radiation characteristics of the antenna to be destroyed

Method used

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  • Strip line-based coaxial feed microstrip antenna
  • Strip line-based coaxial feed microstrip antenna
  • Strip line-based coaxial feed microstrip antenna

Examples

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Embodiment Construction

[0042] The present invention will be described in further detail below in conjunction with specific examples, but the embodiments of the present invention are not limited thereto.

[0043] figure 1 It is a cross-sectional view of a stripline-based coaxial fed microstrip antenna provided by an embodiment of the present invention. See figure 1 , an embodiment of the present invention provides a coaxial fed microstrip antenna 100 based on a stripline 3, comprising: a first metal layer 1;

[0044] The first dielectric layer 2 located on one side of the first metal layer 1; the first dielectric layer 2 includes a stripline 3, and the stripline 3 extends in a direction parallel to the plane where the first metal layer 1 is located;

[0045] The second metal layer 4 located on the side of the first dielectric layer 2 away from the first metal layer 1, the second metal layer 4 includes a first opening 5;

[0046] The second dielectric layer 6 located on the side of the second metal...

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Abstract

The invention discloses a strip line-based coaxial feed microstrip antenna, which relates to the technical field of microwave millimeter communication and comprises a first metal layer, and a first dielectric layer, a second metal layer, a second dielectric layer, a third metal layer, a third dielectric layer and a parasitic patch antenna sequentially positioned on one side of the first metal layer, wherein the first dielectric layer internally comprises a strip line, and the strip line extends in the direction parallel to the plane where the first metal layer is located; the second metal layer comprises a first opening; the second dielectric layer comprises a via hole and a plurality of first through holes; the orthographic projection of the via hole is located in the first opening in the direction perpendicular to the plane where the first metal layer is located; the third metal layer comprises a second opening, and the orthographic projection of the radiation patch antenna is located in the second opening in the direction perpendicular to the plane where the first metal layer is located; and the second metal layer is connected with the third metal layer through the first through hole. The strip line is connected to the radiation patch antenna through the via hole and feeds, so that the gain and the bandwidth of the microstrip antenna are improved.

Description

technical field [0001] The invention belongs to the technical field of microwave and millimeter communication, and in particular relates to a stripline-based coaxial feeding microstrip antenna. Background technique [0002] With the development of modern processing technology, a new type of planar antenna represented by the microstrip antenna has gradually formed. The microstrip antenna has the advantages of low cost, easy mass production, small size, low profile, and can be applied to dual polarization, multi-band, Multi-beam and other environments. [0003] Antenna-in-Package (AiP) technology is a technology that integrates three-dimensional multi-chip components and radio frequency antennas based on packaging materials and processes, with the purpose of realizing the miniaturization design of system-level communication. The antenna-in-package technology integrates the package cavity around the antenna and mounts multi-chip components inside to realize the integrated desi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q9/04H01Q1/00H01Q1/52H01Q1/22H01Q5/10H01Q5/50
CPCH01Q9/0414H01Q9/045H01Q1/002H01Q1/52H01Q5/10H01Q5/50H01Q1/2283
Inventor 董刚朱思曈吴海东朱樟明杨银堂
Owner XIDIAN UNIV