Electroplating device without side surface silver leakage for mechanical template of integrated circuit lead frame

Abstract

The invention relates to the technical field of electroplating, in particular to an electroplating device without side surface silver leakage for a mechanical template of an integrated circuit lead frame. The electroplating device comprises a base, a supporting frame is fixedly installed at the top of the base, a liquid spraying box is fixedly installed in the middle of the top of the base, and a conveying mechanism is arranged on the side face of the liquid spraying box. The conveying mechanism is used for conveying a lead frame, the side face of the liquid spraying box fixedly communicates with a liquid inlet pump, a liquid inlet oil pipe of the liquid inlet pump fixedly communicates with an external liquid supply mechanism, a liquid outlet oil pipe of the liquid inlet pump fixedly communicates with the interior of the liquid spraying box, a plating cavity mold is fixedly installed at the top of the liquid spraying box, and an electroplating opening is formed in the top of the plating cavity mold. An upper pressing die moving downwards drives correction mechanisms on the two sides to move, correction of the position of the lead frame is achieved, the upper pressing die continuously moving downwards is combined to promote a sealing mechanism to extrude and seal the attached position of the lead frame and the electroplating opening, and the phenomenon of silver leakage in the electroplating process is avoided.

Description

technical field [0001] The invention relates to the field of electroplating, in particular to a silver electroplating device without side leakage of a mechanical template of an integrated circuit lead frame. Background technique [0002] Electroplating is the process of plating a thin layer of other metals or alloys on some metal surfaces by using the principle of electrolysis to improve wear resistance, conductivity, light reflection, and corrosion resistance. [0003] The prior art discloses some patent documents about electroplating. The Chinese patent application number 201110134537.3 discloses a patent for an electroplating device for a lead frame, including a spray plate, an anode plate, a substrate and a mask bottom plate. The mask There are a number of electroplating through-holes arrayed on the bottom plate, and the above-mentioned through-holes respectively correspond to the electroplating unit area on the lead frame. The electroplating device completes the electro...

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Problems solved by technology

[0004] When electroplating the lead frame, the electroplating solution is first energized, and then the electroplating solution is sprayed to the position to be electroplated on the lead frame for silver plating. From the place on the lead frame that needs to be silver-plated to the surrounding side leakage to the place that does not need to be silver-plated, there will be side leakage of the electroplating solution, which will cause silver leakage when the lead frame is silver-plated, affecting the use of the later lead frame. Therefore, we propose a silver plating device for integrated circuit lead frame mechanical stencil without side leakage

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