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Semiconductor device, method of forming the same and one-time-programmable memory device

A semiconductor, one-source technology, applied in semiconductor/solid-state device manufacturing, semiconductor devices, semiconductor/solid-state device components, etc., can solve problems such as unsatisfactory orientation

Pending Publication Date: 2022-01-04
TAIWAN SEMICON MFG CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, traditional OTP NVM devices are usually only suitable for their original design purpose, and cannot meet all aspects

Method used

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  • Semiconductor device, method of forming the same and one-time-programmable memory device
  • Semiconductor device, method of forming the same and one-time-programmable memory device
  • Semiconductor device, method of forming the same and one-time-programmable memory device

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Embodiment Construction

[0068]The following disclosure provides many different embodiments or examples for implementing different features of the present invention. The following disclosure describes specific examples of various components and their arrangements to simplify the description. Of course, these specific examples are not intended to be limiting. For example, if the disclosure describes that a first feature is formed on or above a second feature, it means that it may include embodiments in which the above-mentioned first feature is in direct contact with the above-mentioned second feature, and may also include additional features. An embodiment in which the first feature and the second feature are formed between the first feature and the second feature so that the first feature and the second feature may not be in direct contact. In addition, different examples disclosed below may reuse the same reference signs and / or signs. These repetitions are for simplicity and clarity and are not in...

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Abstract

The present disclosure provides a semiconductor device and a method of forming the same. The semiconductor device according to the present disclosure includes a gate structure, a source / drain part, dielectric layers, a gate contact, and source / drain contacts. The source / drain part is adjacent to the gate structure. The dielectric layers are disposed over the gate structure and the source / drain features. The gate contact is disposed in the dielectric layer and on the gate structure. The source / drain contact are arranged between in the dielectric layers and on the source / drain part. The dielectric layer is doped with a dopant, and the dopant includes germanium or tin.

Description

technical field [0001] The present disclosure relates to a semiconductor device, a method of manufacturing the same, and a one-time programmable memory device. Background technique [0002] Among semiconductor memory devices, non-volatile memory (Non-Volatile Memory, NVM) devices can be used to store data even when the memory device is turned off. In various examples, the nonvolatile memory device may include: read only memory (Read Only Memory, ROM), magnetic memory, optical memory, or flash memory, which may exist in different types of nonvolatile memory device. Non-volatile memory devices include: memory devices that can be programmed many times (Multi-Time Programmable, MTP), memory devices that can only be programmed several times (Few-Time Programmable, FTP), and memory devices that can only be programmed once (One-Time Programmable, OTP) memory device. As its name implies, OTP NVM devices can only be successfully programmed once, but MTP NVM devices can be successf...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L27/112H10B12/00
CPCH10B20/25G11C17/16H01L23/5252H01L23/485H01L21/76825H01L29/0607H01L21/265
Inventor 苏信文林士豪陈瑞麟洪连嵘王屏薇
Owner TAIWAN SEMICON MFG CO LTD