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Integrated integrated circuit production system based on aerosol printing

An integrated circuit and production system technology, applied in the field of integrated integrated circuit production system, can solve the problems of unsatisfactory circuit printing accuracy and printing efficiency, poor continuity of circuit board production process, and low circuit board production efficiency, so as to improve production The effects of process continuity, improvement of printing accuracy and printing efficiency, and reduction of human work intensity

Pending Publication Date: 2022-01-04
NANJING NORMAL UNIVERSITY
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In the production of circuit boards, 3D printing technology is also widely used, using 3D printing equipment to print corresponding circuits on the substrate, but the existing 3D printing equipment is not very ideal for the printing accuracy and printing efficiency of the circuit, and the entire circuit The continuity of the production process of the board is poor, so that the production efficiency of the circuit board is not high

Method used

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  • Integrated integrated circuit production system based on aerosol printing
  • Integrated integrated circuit production system based on aerosol printing
  • Integrated integrated circuit production system based on aerosol printing

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Embodiment Construction

[0023] Below in conjunction with accompanying drawing and specific embodiment, further illustrate the present invention, should be understood that these embodiments are only for illustrating the present invention and are not intended to limit the scope of the present invention, after having read the present invention, those skilled in the art will understand various aspects of the present invention Modifications in equivalent forms all fall within the scope defined by the appended claims of this application.

[0024] Such as figure 1 and figure 2 As shown, the present invention provides an integrated integrated circuit production system based on aerosol printing, including a workbench 1, a material adding device, a material reducing device, a transmission track 2 and a digital control system, and the material reducing device is used for preliminary forming The circuit board is polished, the transmission track 2 is used to transport the printing area to each work area, and th...

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Abstract

The invention discloses an integrated circuit production system based on aerosol printing, and the system comprises an additive device, a subtractive device, a transmission track and a digital control system, wherein the additive device and the subtractive device are arranged above the transmission track; the material adding device comprises an extrusion type 3D printing module and an aerosol jet printing module, the extrusion type 3D printing module is used for printing a substrate of a circuit and packaging the circuit after the circuit is printed, and the aerosol jet printing module is used for printing a metal thin layer to print the circuit on the substrate; the material reducing device is used for polishing the preliminarily formed circuit board; and the transmission crawler belt is used for conveying the printing area to each working area. The characteristics of aerosol printing are utilized, the circuit manufacturing time is shortened, the integration degree of the circuit is improved, the printing precision and printing efficiency of the circuit can be improved, the production process continuity of the whole circuit board is improved, and the production efficiency of the circuit board is improved.

Description

technical field [0001] The invention belongs to the field of integrated circuits and relates to the technical field of 3D printing, in particular to an integrated integrated circuit production system based on aerosol printing. Background technique [0002] Additive manufacturing technology, that is, 3D printing technology, is a new type of rapid prototyping technology that gradually emerged in the 1980s. Its development has begun to shake the status of traditional manufacturing, and it has shown unique advantages in many high-tech industries. [0003] There are many different forms of 3D printing, such as FDM, DLP, EBF, SLA, etc., and various materials, such as thermoplastics, various alloys, photosensitive resins, etc., but in a broad sense, the process of 3D printing is mainly divided into three links: Software modeling is to build the model of the target through the computer; slice processing is to slice the model through specific software; model printing is to build the ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K3/14
CPCH05K3/14
Inventor 仲奕君施建平黄睿涛郭保成杨继全冯春梅赵禹翔
Owner NANJING NORMAL UNIVERSITY
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