Split mounting type heat preservation building board

Abstract

The invention discloses a split mounting type heat preservation building board. The split mounting type heat preservation building board comprises square frames, a heat preservation layer, a buffer protection layer and an outer protection layer, wherein limiting inner frames are arranged in one sides of the square frames, packaging layers are arranged on the sides, close to the limiting inner frames, in the square frames in a matched mode, the side faces of the packaging layers are provided with embedded decoration layers matched with the inner sides of the limiting inner frames, and the adjacent square frames are assembled and connected together through assembling units; the heat preservation layer is arranged on the side, close to the packaging layer, in the square frame; the buffer protection layer is arranged on the side, close to the heat preservation layer, in the square frame, and the buffer protection layer is clamped and fixed to the inner side of the square frame through a buffer protection layer fixing assembly; and the outer protection layer is installed on the side, away from the heat preservation layer, of the buffer protection layer through a buckle assembly, a gap is reserved between the bottom of the outer protection layer and the bottom of the inner side of the square frame, and an outer protection layer disassembling and supporting assembly is installed in the gap. A multi-layer structure is adopted, the environment-friendly effect of reducing heat loss is achieved, meanwhile, external collision can be buffered, the damage probability is reduced, the connecting gap is small, and the heat preservation effect is good.

Description

technical field [0001] The invention relates to the technical field of building boards, in particular to an assembled thermal insulation building board. Background technique [0002] The building insulation structure is to reduce the indoor heat of the building to the outside by taking measures on the building's outer enclosure structure, thereby maintaining the building's indoor temperature. Building insulation materials play an important role in creating a suitable indoor thermal environment and saving energy in building insulation. Function, the building insulation structure on the market now generally uses simple foam boards and protective measures. It is also inconvenient to disassemble when damaged and need to be replaced. Contents of the invention [0003] The technical problem to be solved by the present invention is to overcome the existing defects and provide an assembled thermal insulation building board with a multi-layer structure, which can buffer external c...

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Problems solved by technology

[0002] The building insulation structure is to reduce the indoor heat of the building to the outside by taking measures on the building's outer enclosure structure, thereby maintaining the building's indoor temperature. Building insulation materials play an important role in creating a suitable indoor thermal environment and saving energy in building insulation. Function, the building insulation structure on the market now generally uses simple foam boards and protective measures. It is also inconvenient to disassemble when damaged and needs to be replaced

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