Supercharge Your Innovation With Domain-Expert AI Agents!

Printed circuit board coating processing method and device

A technology for printed circuit boards and processing devices, applied in the directions of printed circuits, printed circuit coatings, printed circuit manufacturing, etc., can solve the problems of reducing the overall processing efficiency of printed circuit boards, etc., to facilitate pickling and plating operations, increase contact area, convenient The effect of the coating operation

Active Publication Date: 2022-01-28
深圳市亚恒电路科技有限公司
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a printed circuit board coating processing method and device to solve the problem of manual transport drilling and coating processing, which reduces the overall processing efficiency of printed circuit boards.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Printed circuit board coating processing method and device
  • Printed circuit board coating processing method and device
  • Printed circuit board coating processing method and device

Examples

Experimental program
Comparison scheme
Effect test

Embodiment Construction

[0040] see Figure 1-9 , the present invention provides a technical solution: a printed circuit board coating processing device, including a bottom frame 1, a middle sparse component 2 is fixedly installed in the middle of the top of the bottom frame 1, and a first motor is fixedly installed on one side of the middle sparse component 2 3. The middle sparse component 2 is provided with a rotating component 4 on the side close to the first motor 3, and the feeding component 6 is fixedly installed on the side of the bottom frame 1 away from the rotating component 4, and the top of the bottom frame 1 is close to the feeding component 6. The side is fixedly installed with the second motor 5, the side of the bottom frame 1 near the rotating assembly 4 is fixedly installed with a sinking transmission assembly 7, the middle part of the top of the middle sparse assembly 2 is fixedly equipped with a drilling mechanism 8, and the middle part of the middle sparse assembly 2 There is a bot...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

No PUM Login to View More

Abstract

The invention discloses a printed circuit board coating processing method and device in the technical field of circuit board processing, and the device comprises a bottom frame, a middle sparse assembly is fixedly installed in the middle of the top end of the bottom frame, a first motor is fixedly installed on one side of the middle sparse assembly, and a rotating assembly is arranged on the side, close to the first motor, of the middle sparse assembly; and a feeding assembly is fixedly installed on the side, away from the rotating assembly, of the top end of the bottom frame, and a second motor is fixedly installed on the side, close to the feeding assembly, of the top end of the bottom frame. Through the arrangement of the feeding assembly, the circuit board base material placed in the material storage frame can be indirectly pushed into the feeding frame in the vertical state, and the multiple circuit board base materials can be effectively and sequentially conveyed to the position of the first half roller in cooperation with indirect positive and negative 90-degree rotation of the feeding frame, so that sequential automatic feeding of the multiple circuit board base materials is achieved, the subsequent processing effect of the circuit board base materials is improved, and the overall processing efficiency of the circuit board base materials is improved.

Description

technical field [0001] The invention relates to the technical field of circuit board processing, in particular to a printed circuit board coating processing method and device. Background technique [0002] Printed circuit board, also known as printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical interconnection of electronic components. Because it is made by electronic printing, it is called "printed circuit board". "circuit board, [0003] In the prior art, in the process of processing and manufacturing printed circuit boards, manual transportation is often used. First, a plurality of circuit board base materials are transported to the drilling mechanism one by one for drilling, and then the drilling is performed. The final circuit board base material is hand-held and transported to the pickling tank for clamping and pickling plating; [0004] Using this transportation method for drilling and coating...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): H05K3/00
CPCH05K3/00H05K3/0047H05K3/0091
Inventor 陈亚叶
Owner 深圳市亚恒电路科技有限公司
Features
  • R&D
  • Intellectual Property
  • Life Sciences
  • Materials
  • Tech Scout
Why Patsnap Eureka
  • Unparalleled Data Quality
  • Higher Quality Content
  • 60% Fewer Hallucinations
Social media
Patsnap Eureka Blog
Learn More