Wafer glass gluing system and gluing method

Abstract

The invention relates to the technical field of electronic component processing, and particularly discloses a wafer glass gluing system and a gluing method. The system is used for gluing a glass body and comprises a carrying module and a first operating platform with a first station and a second station, wherein the first operating platform is provided with a first gluing module, a second gluing module, two supporting assemblies and a heating module used for heating a glass body located at a heating station; the first gluing module is used for smearing IPA and ADP on the glass body located at the first station; the second gluing module is used for smearing PR on the glass body located at the second station; one of the two supporting assemblies is used for uniformly paving IPA and ADP on the glass body, and the other supporting assembly is used for uniformly paving PR on the glass body; and the carrying module is used for carrying the glass body. Through the design, the risk that the surface of the wafer glass is polluted before ADP is smeared can be avoided, so that the cleanliness of the smeared glue is improved, and the condition that the wafer glass is unclean in development is improved.

Description

technical field [0001] The invention relates to the technical field of processing electronic components, in particular to a wafer glass gluing system and gluing method. Background technique [0002] In the packaging operation of the camera chip, it is necessary to bond the glass of the cofferdam on the wafer, so that a thick sealed cavity is formed between the wafer body and the wafer glass, so as to achieve the purpose of protecting the photosensitive area of ​​the image sensor. The support between the wafer body and the wafer glass is a cofferdam, and the cavity around the cofferdam is a photosensitive area, which is formed by optical glass photolithography. If the PR (Photoresist, photoresist) in the photosensitive area is not cleaned after development, it cannot be removed by cleaning in the subsequent process. As a result, the photosensitive area will be polluted, which will affect the imaging of the pixels in the photosensitive area, resulting in poor packaging. [0...

AI Technical Summary

Problems solved by technology

The coating process of each of the above pipelines is completed in one cavity. During operation, the fourth pipeline 810, the fifth pipeline 820 and the sixth pipeline 830 are simultaneously arranged on the third gluing arm 700; The application amount of PR is large and highly volatile. The high-speed rotation of PR during application will cause PR splashing, which will cause serious pollution to the cavity. Due to the above hidden dangers, the glass body 900 will have PR pollution during operation. After baking and curing, it will lead to dirty development

However, when ADP is applied, the glass body 900 may be polluted due to the presence of PR

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