Carrier plate baking system and baking method
A baking method and a carrier plate technology are applied in the field of solar cells to achieve the effect of efficient and sufficient removal
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Embodiment 1
[0035] see figure 1 and figure 2 , the carrier board baking system 100 of the embodiment of the present application includes a laser baking chamber 102 and transportation equipment, the laser baking chamber 102 is provided with a laser heating source 101, and the laser heating source 101 is used for the carrier board of the silicon wafer 103 is baked, and the transport equipment is used to transport the carrier plate 103 passed out from the discharge port of the coating equipment to the laser baking chamber 102, and is used to transport the baked carrier plate 103 from the laser baking chamber 102 To the feed port of the coating equipment.
[0036] The carrier plate baking system 100 of the embodiment of the present application uses a laser heating source 101 after the carrier plate 103 of the silicon wafer is passed out of the discharge port of the coating device and before the carrier plate 103 is introduced into the feed port of the coating device. Baking the carrier pla...
Embodiment 2
[0051] In some optional embodiments, the laser baking chamber 102 is provided with a preset position for placing the carrier plate 103, the baking system 100 includes a position detector 104 arranged in the laser baking chamber, and the position detector 104 is used to detect the position of the carrier plate 103. Whether the board 103 reaches the preset position, the transportation device is used to stop the carrier board 103 at the preset position when the carrier board 103 arrives at the preset position. In this way, the carrier plate 103 is stationary and heated at the preset position in the laser baking chamber 102, avoiding low baking efficiency due to improper position, and also preventing the moving carrier plate 103 from leaving the laser before drying. The chamber 102 is baked.
[0052] Specifically, the position detector 104 may include a distance measuring device. Examples include laser ranging sensors, acoustic ranging sensors, depth cameras, and the like. When ...
Embodiment 3
[0056] In some optional embodiments, the laser baking chamber 102 is provided with a preset position for placing the carrier plate 103, the number of laser heating sources 101 is multiple, and part of the laser heating sources 101 are arranged above the preset position, and the rest The laser heating source 101 is arranged below the preset position. In this way, both sides of the carrier board 103 can be baked, with higher efficiency and better effect.
[0057] Specifically, there may be multiple preset positions. In this way, multiple carriers 103 can be baked at the same time, which can improve the efficiency of baking.
[0058] Further, the distance between adjacent preset positions is the same as the distance between adjacent carrier boards 103 on the conveyor belt. In this way, when the conveyor belt stops moving, when one carrier board 103 is located at the corresponding preset position, the rest of the carrier boards 103 are also located at the corresponding preset po...
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