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Circuit board assembly and production method thereof, and electronic equipment

A technology of circuit board components and components, which is applied in the direction of printed circuit manufacturing, circuits, electrical components, etc., can solve the problems of reducing inductance, etc., and achieve the effects of reducing magnetic resistance, increasing inductance value, and reducing size and area

Pending Publication Date: 2022-02-18
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

At present, the magnetic core coil of the inductor can be integrated on the circuit board, but this will reduce the inductance

Method used

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  • Circuit board assembly and production method thereof, and electronic equipment
  • Circuit board assembly and production method thereof, and electronic equipment
  • Circuit board assembly and production method thereof, and electronic equipment

Examples

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Embodiment Construction

[0043] The following are preferred embodiments of the application. It should be pointed out that those skilled in the art can make some improvements and modifications without departing from the principle of the application, and these improvements and modifications are also considered as the present invention. The scope of protection applied for.

[0044] Before introducing the technical solution of the present application, the technical problems in the related art will be introduced in detail.

[0045] With the continuous development of the times and technology, the trend of miniaturization of electronic equipment continues to develop. Therefore, the electronic hardware in the electronic equipment is also constantly changing towards the trend of miniaturization and high density. For example, the area and size of circuit boards have decreased dramatically, but with the continuous increase in the functions of electronic equipment, the number of electronic components required to...

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Abstract

The invention provides a circuit board assembly and a production method thereof, and electronic equipment. The circuit board assembly comprises at least one core board assembly, and each core board assembly comprises a substrate, a coil, a first magnetic layer, a second magnetic layer and a third magnetic layer. The substrate has a first surface and a second surface opposite to each other. The substrate has a first through hole penetrating through the first surface and the second surface. The coil includes a first portion disposed on the first surface. The first magnetic layer is disposed on the first surface and covers at least a portion of the first portion. The second magnetic layer is arranged on the second surface. The third magnetic layer is arranged in the first through hole and is connected with the first magnetic layer and the second magnetic layer. The coil is integrated on the substrate so that the size and the area of the circuit board assembly are reduced. Meanwhile, the first magnetic layer, the second magnetic layer and the third magnetic layer are additionally arranged, the upper magnetic layer and the lower magnetic layer are communicated through the first through hole, the magnetic resistance of magnetic induction lines on one side of the first surface, one side of the second surface and in the substrate is reduced, and the inductance value of the circuit board assembly is increased.

Description

technical field [0001] The application belongs to the technical field of circuit boards, and in particular relates to circuit board components, a preparation method thereof, and electronic equipment. Background technique [0002] With the miniaturization and high-density development trend of electronic hardware, the area of ​​the circuit board has been reduced sharply, but the electronic components required to be mounted on the circuit board have not decreased. For example, in a power module, inductive devices occupy a large amount of circuit board area. Currently, the magnetic core coil of the inductor can be integrated on the circuit board, but this will reduce the inductance. Contents of the invention [0003] In view of this, the first aspect of the present application provides a circuit board assembly, including at least one core board assembly, each of which includes: [0004] a substrate having a first surface and a second surface disposed opposite to each other, ...

Claims

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Application Information

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IPC IPC(8): H05K1/16H05K3/30H05K3/02H05K3/10H01F41/02H01F41/04H05K7/14
CPCH05K1/165H05K3/30H05K3/02H05K3/10H01F41/02H01F41/041H05K7/1402
Inventor 陈奕君
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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