Substrate processing apparatus

Abstract

A substrate processing apparatus includes a rotating chuck which is rotatably installed inside a cup housing and on which a substrate is mounted, a nozzle table rotatably installed inside the rotating chuck, a guide installed inside the nozzle table, a moving module movably installed on the guide, a guide arm configured to support a fluid supply line part, a lower nozzle part coupled to the guide arm to move together with the moving module and connected to the fluid supply line part, a driving shaft part connected to the rotating chuck and the nozzle table to rotate the rotating chuck and the nozzle table, a moving shaft rotatably installed inside the driving shaft part and connected to the moving module to move the moving module, and a driver connected to the driving shaft part and the moving shaft so as to drive the driving shaft part and the moving shaft.

Description

technical field [0001] The present invention relates to a substrate processing apparatus, and more specifically, to a substrate processing apparatus capable of simultaneously processing both sides of a substrate and preventing chemical liquid from remaining inside a nozzle table. Background technique [0002] Generally, in a semiconductor device, a predetermined thin film is formed on a silicon wafer used as a semiconductor substrate. As the silicon wafer undergoes unit processes such as chemical vapor deposition, sputtering, photolithography, etching, ion implantation, chemical mechanical polishing, etc., a thin film pattern is formed on the silicon wafer. [0003] A plurality of thin films are formed on a semiconductor wafer in order to manufacture semiconductor devices. Typically, an etching process is used to form multiple thin films. In the etching process, foreign substances adhere to the backside of the semiconductor wafer. Therefore, in order to remove the foreign ...

AI Technical Summary

Problems solved by technology

[0004] However, conventionally, when the processing liquid of the semiconductor device remains in the lower nozzle part and the nozzle drive module, mist may be generated due to the volatility of the processing liquid in the cleaning process, or residual substances may be generated in the drying process. rebound phenomenon

Therefore, cleaning spray may be generated or substrate defects may occur

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