Through silicon via (TSV)-based delay equalization device

Abstract

The invention discloses a through silicon via (TSV)-based delay equalization device, which comprises six TSV inductors and eight double-layer interdigital capacitors, and comprises eight double-layer interdigital capacitor layers (top RDL), interconnection keys (copper), an interconnection layer, interconnection keys and six TSV inductors from top to bottom in sequence. The equalization device provided by the invention not only has stable delay performance and low loss at low frequency, but also is compact in structure and high in integration level.

Description

technical field [0001] The invention belongs to the technical field of three-dimensional integrated circuits, and relates to a delay equalization device based on through-silicon holes. Background technique [0002] The networks we have discussed so far have features that are used to obtain the desired amplitude and frequency. The all-pass filter is also a very important class. This type of circuit network has a flat frequency response, but introduces a fixed phase shift and frequency. The all-pass filter is often called a delay equalizer. [0003] In terms of delay devices, an all-pass filter is available for analog group delay equalizers. An ideal form of an allpass network has constant amplitude and a specific group delay response, and an arbitrary group delay response can be achieved using a group delay equalizer. Equalizers can be used with narrower bandwidths and more selective filters. With the development of microelectronics technology, the characteristic size of t...

AI Technical Summary

Problems solved by technology

For high-order delay networks, due to the complex circuit network when integrating components, it faces the problem of large integrated structure area.

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