Integrated circuit chip mounting equipment

A technology of integrated circuits and patches, applied in the direction of electrical components, electrical components, etc., can solve the problems of abnormal material belts and reduced work efficiency of devices, and achieve the effects of improving operating efficiency, facilitating detection and processing, and facilitating disassembly and use

Active Publication Date: 2022-02-25
江苏华讯电子技术有限公司
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] Aiming at the deficiencies of the prior art, the present invention provides an integrated circuit placement device, which has the advantages of avoiding abnormality of the material tape and improving the working efficiency of the device, and solves the problem that the device often alarms and reduces the working efficiency due to the abnormality of the material tape. question

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Embodiment Construction

[0028] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0029] As introduced in the background technology, there are deficiencies in the prior art. In order to solve the above technical problems, the present application proposes an integrated circuit placement device.

[0030] In a typical implementation of the present application, such as Figure 1-8 As shown, an integrated circuit chip placement device includes a body 1, on which a detection structure, a processing structure, and a working structure are arranged....

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Abstract

The invention relates to the technical field of integrated circuit mounting, and discloses integrated circuit mounting equipment. The equipment comprises a machine body, a detection structure, a processing structure and a working structure are arranged on the machine body, abnormal segments on a material belt are cut off through cooperative operation of the detection structure and the processing structure, and the front end and the rear end are bonded again so that the working structure can operate normally. The detection structure is used for detecting the use condition of the material belt so as to determine the integrity of the material belt, the processing structure is used for processing the material belt after abnormity is detected, abnormal sections on the material belt are cut off, then the broken material belt is bonded, the working structure is used for carrying out surface mounting processing on a substrate, and the detection structure and the processing structure are used for cooperatively operating. When the material belt is used again, the situation that the equipment is stuck due to the abnormal condition of the material belt and gives an alarm is avoided, and the operation efficiency of the equipment is effectively improved.

Description

technical field [0001] The invention relates to the field of integrated circuit patching technology, in particular to an integrated circuit patching device. Background technique [0002] SMT is Surface Mount Technology (Surface Mount Technology), which is the most popular technology and process in the electronic assembly industry. It is a circuit assembly technology that mounts non-lead or short-lead surface mount components on the surface of a printed circuit board or other substrates, and solders and assembles them by reflow soldering or dip soldering. Among them, the placement machine is a device that accurately places surface mount components on the PCB pads by moving the placement head. [0003] For example, in the publication number CN111757665B, by setting a highly automated placement machine, automatic glue coating and automatic drying when the substrate is passed in and out are realized to ensure the continuity of the production process, thereby improving the place...

Claims

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Application Information

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IPC IPC(8): H05K13/02H05K13/04H05K13/08
CPCH05K13/02H05K13/028H05K13/0469H05K13/082H05K13/086
Inventor 朱红辉
Owner 江苏华讯电子技术有限公司
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