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On chip wafer alignment sensor

A technology of sensor equipment and optical devices, which is applied in the direction of instruments, photoplate-making process of pattern surface, measuring device, etc., and can solve the problem of not supporting alignment grating spacing and so on

Pending Publication Date: 2022-02-25
ASML HLDG NV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

These systems also do not support finer alignment grating pitches, such as grating pitches less than about 1 micron

Method used

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  • On chip wafer alignment sensor
  • On chip wafer alignment sensor
  • On chip wafer alignment sensor

Examples

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Embodiment Construction

[0028] This specification discloses one or more embodiments that incorporate the features of this invention. The disclosed embodiments are merely illustrative of the invention. The scope of the invention is not limited to the disclosed embodiments. The invention is defined by the claims appended hereto.

[0029] The described embodiments and references in this specification to "one embodiment," "an embodiment," "example embodiment," etc. indicate that the described embodiment may include a particular feature, structure, or characteristic, but each embodiment may The specific features, structures or characteristics need not be included. Moreover, these phrases are not necessarily referring to the same embodiment. In addition, when a particular feature, structure or characteristic is described in conjunction with an embodiment, it is to be understood that it is within the purview of those skilled in the art to implement such feature, structure or characteristic in combination...

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Abstract

A sensor apparatus includes an illumination system, a detector system, and a processor. The illumination system is configured to transmit an illumination beam along an illumination path and includes an adjustable optic. The adjustable optic is configured to transmit the illumination beam toward a diffraction target on a substrate that is disposed adjacent to the illumination system. The transmitting generates a fringe pattern on the diffraction target. A signal beam includes diffraction order sub-beams that are diffracted by the diffraction target. The detector system is configured to collect the signal beam. The processor is configured to measure a characteristic of the diffraction target based on the signal beam. The adjustable optic is configured to adjust an angle of incidence of the illumination beam on the diffraction target to adjust a periodicity of the fringe pattern to match a periodicity of the diffraction target.

Description

[0001] Cross References to Related Applications [0002] This application claims priority to U.S. Provisional Patent Application No. 62 / 877,964, filed July 24, 2019, which is incorporated herein by reference in its entirety. technical field [0003] The present disclosure relates to sensor devices and systems, eg, for lithographic devices and systems. Background technique [0004] A lithographic apparatus is a machine configured to apply a desired pattern onto a substrate. A lithographic apparatus may be used, for example, in integrated circuit (IC) fabrication. A lithographic apparatus may eg project a pattern of a patterning device (eg mask, reticle) onto a layer of radiation sensitive material (resist) provided on a substrate. [0005] To project a pattern onto a substrate, a lithographic apparatus may use electromagnetic radiation. The wavelength of this radiation determines the minimum size of features that can be formed on the substrate. A lithographic apparatus us...

Claims

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Application Information

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IPC IPC(8): G03F9/00
CPCG03F9/7049G03F9/7088G03F9/7069G01B11/272
Inventor T·M·T·A·M·埃拉扎里M·斯威拉姆
Owner ASML HLDG NV
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