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Al-Si-Cu high-thermal-conductivity die-casting aluminum alloy and preparation method thereof

A technology of al-si-cu and cast aluminum alloy, which is applied in the field of aluminum alloy materials, can solve the problems such as the decline of thermal conductivity, and achieve the effects of improving strength, avoiding deformation, and increasing fluidity

Active Publication Date: 2022-03-01
上海交通大学重庆研究院
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0006] In view of the above-mentioned deficiencies existing in the prior art, the object of the present invention is to provide an Al-Si-Cu high thermal conductivity die-casting aluminum alloy to solve the problem of the thermal conductivity of the prior art aluminum alloy being reduced after adding other elements

Method used

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  • Al-Si-Cu high-thermal-conductivity die-casting aluminum alloy and preparation method thereof
  • Al-Si-Cu high-thermal-conductivity die-casting aluminum alloy and preparation method thereof
  • Al-Si-Cu high-thermal-conductivity die-casting aluminum alloy and preparation method thereof

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Embodiment 1

[0025] Taking Embodiment 1 as an example, it specifically includes the following steps:

[0026] (1) Raw material preparation: Al ingot, Al-Sr alloy, Al-RE alloy, Al-Cu alloy, elemental 3303Si, and pure Fe powder are quantitatively prepared according to the mass percentage. Among them, Fe and Si can be added in the form of pure metal, and RE and Cu can be added in the form of master alloy.

[0027] (2) Melting: After melting the Al ingot, heat up to 750°C, add Fe powder and pure Si, melt the Al-Cu alloy, stir evenly, and obtain melt I; cool down to 700°C, add the Al- The RE alloy was melted to obtain Melt II; it was then left to stand for 30 minutes.

[0028] (3) Die-casting: the temperature of the melt II was lowered to 700° C., and the scum on the surface was removed, and cast into an ingot to obtain the low-silicon, low-iron, and high-fluidity high-thermal conductivity die-casting aluminum alloy. Wherein, based on the mass percentage of the melt II, the added amount of th...

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Abstract

The invention discloses an Al-Si-Cu high-thermal-conductivity die-casting aluminum alloy and a preparation method thereof, and the Al-Si-Cu high-thermal-conductivity die-casting aluminum alloy comprises the following components in percentage by mass: 1.5-3% of Si; the content of Cu is 0.5%-1.2%; the content of Fe is 0.4%-1.3%; and the balance of Al and inevitable impurities. According to the aluminum alloy disclosed by the invention, a proper amount of Fe and a trace amount of RE element are added while the content of Si is reduced, so that the die-casting demolding property is ensured, and the thermal conductivity of the aluminum alloy subjected to T5 heat treatment can reach 200 W / (m.K) or above and is close to the thermal conductivity of 239 W / (m.K) of pure aluminum.

Description

technical field [0001] The invention relates to the technical field of aluminum alloy materials, in particular to an Al-Si-Cu high thermal conductivity die-casting aluminum alloy and a preparation method thereof. Background technique [0002] At present, 3C products, automotive communication electronics and other fields are facing increasing pressure to reduce weight. At the same time, some components often have higher requirements on the thermal conductivity of materials (especially heat dissipation devices), so as to ensure and improve the service life and working stability of the product. [0003] Aluminum alloy has good comprehensive properties, and its advantages such as low density, high strength, good electrical and thermal conductivity, and simple processing can better meet the product structure and heat dissipation requirements, so it is widely used in the fields of automobiles, electronics, and communications. The thermal conductivity of pure aluminum at room temp...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C22C21/02C22C1/03C22C1/06B22D17/00
CPCC22C21/02C22C1/03C22C1/026C22C1/06B22D17/00
Inventor 宋成猛孙自来
Owner 上海交通大学重庆研究院
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