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SIP (Session Initiation Protocol) packaging selective sputtering method

A selective, sputtering technology, used in electrical components, non-polymeric organic compound adhesives, electrical solid devices, etc., which can solve the problem of limited tape, protective cover or metal cover size and accuracy, inability to achieve complex shapes or The problems of fine area protection and complex process can achieve the effect of reasonable ratio, lower production cost and simple process

Pending Publication Date: 2022-03-01
上海昀通电子科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0008] Therefore, the method provided by the prior art requires manual placement, and the process is complicated, limited by the size and precision of the tape, protective cover or metal cover, and cannot achieve protection of complex shapes or fine areas.

Method used

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  • SIP (Session Initiation Protocol) packaging selective sputtering method
  • SIP (Session Initiation Protocol) packaging selective sputtering method
  • SIP (Session Initiation Protocol) packaging selective sputtering method

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0059] This embodiment provides a method for selective sputtering of a SIP package, the method comprising the following steps:

[0060] (1) Coating pyrolytic adhesive on the non-sputtering area of ​​the SIP package module; the method of coating pyrolytic adhesive is glue spraying;

[0061] (2) Use a UV-LED lamp to irradiate the glue spraying area, so that the pyrolytic adhesive described in step (1) is fully cured to form a pyrolytic UV adhesive layer;

[0062] (3) Perform metal sputtering to form an electromagnetic shielding layer in the sputtering area; the pyrolytic adhesive does not pyrolyze or deform during the metal sputtering process;

[0063] (4) After the sputtering is completed, the temperature is raised to 200° C., the pyrolytic UV adhesive layer expands and falls off, and the electromagnetic shielding layer attached to it is taken away, and the selective sputtering of the SIP package is completed.

[0064] The pyrolytic adhesive described in this embodiment compri...

Embodiment 2

[0069] This embodiment provides a method for selective sputtering of a SIP package, the method comprising the following steps:

[0070] (1) Coating pyrolytic adhesive on the non-sputtering area of ​​the SIP package module; the method of coating pyrolytic adhesive is glue spraying;

[0071] (2) Use a UV-LED lamp to irradiate the glue spraying area, so that the pyrolysis adhesive described in step (1) is fully cured;

[0072] (3) Perform metal sputtering to form an electromagnetic shielding layer in the sputtering area; the pyrolytic adhesive does not pyrolyze or deform during the metal sputtering process;

[0073] (4) After the sputtering is completed, the temperature is raised to 200° C., the pyrolytic adhesive expands and falls off, and the electromagnetic shielding layer attached thereto is taken away, and the selective sputtering of the SIP package is completed.

[0074] The pyrolytic adhesive described in this embodiment comprises the following components:

[0075]

...

Embodiment 3

[0079] This embodiment provides a method for selective sputtering of a SIP package, the method comprising the following steps:

[0080] (1) Coating pyrolytic adhesive on the non-sputtering area of ​​the SIP package module; the method of coating pyrolytic adhesive is glue spraying;

[0081] (2) Use a UV-LED lamp to irradiate the glue spraying area, so that the pyrolysis adhesive described in step (1) is fully cured;

[0082] (3) Perform metal sputtering to form an electromagnetic shielding layer in the sputtering area; the pyrolytic adhesive does not pyrolyze or deform during the metal sputtering process;

[0083] (4) After the sputtering is completed, the temperature is raised to 200° C., the pyrolytic adhesive expands and falls off, and the electromagnetic shielding layer attached thereto is taken away, and the selective sputtering of the SIP package is completed.

[0084] The pyrolytic adhesive described in this embodiment comprises the following components:

[0085]

...

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Abstract

The invention provides an SIP (Session Initiation Protocol) packaging selective sputtering method. The method comprises the following steps: (1) coating a pyrolysis adhesive on a non-sputtering area of an SIP packaging module; (2) curing the pyrolysis adhesive in the step (1); (3) sputtering is carried out, and an electromagnetic shielding layer is formed in a sputtering area; and (4) after sputtering coating is completed, heating is carried out, the pyrolysis adhesive is made to fall off, and SIP packaging selective sputtering coating is completed. According to the method provided by the invention, automatic operation can be realized, a non-sputtering coating area can be finely positioned, labor is greatly reduced, the process cost is relatively low, and the method is simple, convenient and practical.

Description

technical field [0001] The invention belongs to the technical field of semiconductor packaging and relates to a packaging method, in particular to a selective sputtering method for SIP packaging. Background technique [0002] Electronic system packaging structure (System In a Package, SIP) is a single standard package that combines multiple active electronic components with different functions, optional passive electronic components, such as MEMS or optical devices, to achieve certain functions. pieces. From an architectural point of view, SIP is to integrate multiple functional chips, such as processors, memory and other functional chips into one package, so as to realize a basically complete function; Different chips are packaged side by side or stacked, and SOC is a highly integrated chip product. [0003] Electronic equipment is developing towards miniaturization. Therefore, ultra-thin and highly integrated SIP packaging is becoming more and more important. However, wh...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L21/56H01L23/552C09J4/06C09J4/02
CPCH01L21/56H01L23/552C09J4/06
Inventor 刘翘楚何锋江中洋
Owner 上海昀通电子科技有限公司