Pole piece and lithium ion battery
A lithium-ion battery and pole piece technology, which is applied in battery electrodes, secondary batteries, electrode carriers/current collectors, etc., can solve the problem of difficulty in effectively controlling the lithium replenishment process, and achieve the effect of improving controllability
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0059] The pole piece includes:
[0060] Copper foil current collector, set a layer of dense semiconductor layer on the surface of copper foil, the semiconductor layer is a heat-sensitive material with a thickness of 100nm, and the formula (mass ratio) is ZnO:NiO:Al 2 o 3 : Fe 2 o 3 =0.3:0.3:0.3:0.1, the surface resistance of the semiconductor layer at 25°C is 2.3*10 4 mΩ·m 2 , the surface resistance of the semiconductor layer at 60°C is 2.6*10 -3 mΩ·m 2 ; An alkali metal supplementary layer is provided on the side of the semiconductor layer away from the copper foil, and the thickness of the alkali metal supplementary layer is 50 μm.
Embodiment 2
[0062] The pole piece includes:
[0063] Copper foil current collector, set a layer of dense semiconductor layer on the surface of copper foil, the semiconductor layer is a heat-sensitive material with a thickness of 500nm, and the formula (mass ratio) is ZnO:NiO:Al 2 o 3 : Fe 2 o 3 =0.4:0.4:0.1:0.1, the surface resistance of the semiconductor layer at 25°C is 9*10 4 mΩ·m 2 , the surface resistance of the semiconductor layer at 60°C is 1.6*10 -2 mΩ·m 2 ; An alkali metal supplementary layer is provided on the side of the semiconductor layer away from the copper foil, and the thickness of the alkali metal supplementary layer is 300 μm.
Embodiment 3
[0065] The pole piece includes:
[0066] Copper foil current collector, a dense semiconductor layer is set on the surface of the copper foil. The semiconductor layer is a heat-sensitive material with a thickness of 180nm and a formula (mass ratio) of ZnO:NiO:Al 2 o 3 =0.4:0.4:0.2, the surface resistance of the semiconductor layer at 25°C is 6.3*10 4 mΩ·m 2 , the sheet resistance of the semiconductor layer at 60°C is 1.0*10 -3 mΩ·m 2 ; An alkali metal supplementary layer is provided on the side of the semiconductor layer away from the copper foil, and the thickness of the alkali metal supplementary layer is 125 μm.
PUM
Property | Measurement | Unit |
---|---|---|
thickness | aaaaa | aaaaa |
surface resistance | aaaaa | aaaaa |
surface resistance | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com