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Adaptive adjustment system for electronic device package

An electronic device, self-adaptive technology, applied in the direction of circuits, electrical components, electric solid-state devices, etc.

Pending Publication Date: 2022-03-04
BAIDU USA LLC
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Additionally, dedicated active cooling systems may require specific tuning procedures to operate under specific operating conditions

Method used

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  • Adaptive adjustment system for electronic device package
  • Adaptive adjustment system for electronic device package
  • Adaptive adjustment system for electronic device package

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Embodiment Construction

[0025] Various embodiments and aspects of the invention will be described with reference to the details discussed below, and the accompanying drawings will illustrate the various embodiments. The following description and drawings illustrate the present invention and should not be construed as limiting the present invention. Numerous specific details are described to provide a thorough understanding of various embodiments of the invention. However, in certain instances, well-known or conventional details are not described in order to provide a concise discussion of embodiments of the invention.

[0026] Reference in the specification to "one embodiment" or "an embodiment" means that a particular feature, structure or characteristic described in connection with the embodiment can be included in at least one embodiment of the invention middle. The appearances of the phrase "in one embodiment" in various places in the specification are not necessarily all referring to the same ...

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Abstract

An adaptive electronic device package includes an electronic chip, a resistive material having a resistivity of a negative temperature coefficient, the resistive material thermally coupled to the electronic chip, and a thermoelectric cooler thermally coupled to the electronic chip. The thermoelectric cooler is electrically connected in series with the resistive material and the power source to cool the electronic chip, in which if the temperature of the electronic chip increases, the resistance of the resistive material decreases to cause the voltage supplied to the thermoelectric cooler to increase, and if the temperature of the electronic chip decreases, the resistance of the resistive material decreases to cause the voltage supplied to the thermoelectric cooler to increase. If so, the resistance of the resistive material increases to cause the voltage / current applied to the thermoelectric cooler to decrease. The resilient adaptive cooling system eliminates any control hardware, firmware and / or software that may be expensive, complex and may require additional packaging space and / or adjustments.

Description

technical field [0001] Embodiments of the present invention generally relate to electronic device cooling. More specifically, embodiments of the present invention relate to methods and adaptive regulation systems for electronic device packaging. Background technique [0002] Active cooling control systems for integrated circuit (IC) devices typically require hardware and / or software components, including sensors, cables, and software, to regulate system temperature. In some cases, component failures in cooling control systems can negatively impact system performance. In addition, such adjustment systems increase the complexity of packaging. [0003] For electronics packaging, space is limited to implement an active cooling system for the electronics packaging. Additionally, dedicated active cooling systems may require specific tuning procedures to operate under specific operating conditions. Contents of the invention [0004] In one aspect, the present invention provid...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/38H01L23/467H01L35/10H10N10/13H10N10/17H10N10/82H10N19/00
CPCH01L23/38H01L23/467H10N10/82H01L23/46H10N19/00H10N10/13H10N10/17H01L23/473
Inventor 高天翼
Owner BAIDU USA LLC