Terahertz broadband modulator based on 3D printing technology and manufacturing method thereof
A 3D printing and modulator technology, applied in the field of terahertz wave modulation, can solve problems such as poor modulation effect
Pending Publication Date: 2022-03-08
SHENZHEN UNIV
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Problems solved by technology
[0004] The embodiment of the present invention provides a terahertz broadband modulator based on 3D printing technology and its manufacturing method, aiming to solve the problem of poor modulation effect on terahertz waves existing in the terahertz modulator in the prior art method question
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[0026] The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
[0027] It is to be understood that, when used in this specification and the appended claims, the terms "comprising" and "comprising" indicate the presence of the described features, integers, steps, operations, elements and / or components, but do not exclude one or The presence or addition of a number of other features, integers, steps, operations, elements, components, and / or sets thereof.
[0028] It should also be understood that the termi...
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Abstract
The invention discloses a terahertz broadband modulator based on a 3D printing technology and a manufacturing method thereof, the modulator comprises a field source and a regulation and control device, the regulation and control device comprises a substrate, a structural layer arranged on the upper layer of the substrate, an active layer arranged on the upper layer of the structural layer, and a protective layer arranged on the upper layer of the active layer, the first electrode layer and the second electrode layer are respectively arranged on two sides of the protective layer and are in contact with the active layer; the structural layer is manufactured through a 3D printing technology of surface projection stereo photocuring; the structural layer is formed by closely arranging a plurality of hollow cubes; through holes communicated with the inner cavity are formed in the upper end face and the four side faces of the hollow cube; a built-in thin film layer is laid in an inner cavity of the hollow cube; the active layer is provided with communicating holes corresponding to the through holes formed in the upper end face of the hollow cube in the structural layer. According to the modulator, active regulation and control of terahertz based on a light field, an electric field or a magnetic field can be realized by using the hollow cube with the sub-wavelength, and the modulation effect of terahertz waves is greatly improved.
Description
technical field [0001] The invention relates to the technical field of terahertz wave modulation, in particular to a terahertz broadband modulator based on 3D printing technology and a manufacturing method thereof. Background technique [0002] Terahertz (THz) waves usually refer to electromagnetic waves with a frequency range of 0.1 to 10.0 THz and a wavelength of 0.03 to 3 mm, and the wavelength band is exactly between microwave and infrared light. Terahertz waves possess many unique properties compared to other wavelengths such as microwaves and infrared light. Such as low photon energy, high penetration, broadband, strong coherence and other advantages. These characteristics make terahertz waves have broad application prospects in the fields of communication, terahertz imaging sensing, biomedicine, and security detection. [0003] In the field of terahertz technology, terahertz modulation devices are the core components for the application of terahertz technology, whic...
Claims
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IPC IPC(8): G02F1/01C23C16/30C23C14/35C23C14/20C23C14/06B33Y80/00B29C64/124
CPCG02F1/01B29C64/124B33Y80/00C23C14/0623C23C16/305C23C14/35C23C14/205
Inventor 张敏陈润宋琦梁华伟谢心如王嘉彤刘佳睿陈俊展康柳
Owner SHENZHEN UNIV