Anti-splashing laser tin soldering equipment and welding method

Abstract

The invention provides anti-splashing laser soldering equipment which comprises a moving module, a cantilever extending in the horizontal direction is arranged on the moving module, a rotating plate is arranged below the cantilever, a plumbing arm and a first laser head which are arranged along the axis of the rotating plate are arranged below the rotating plate, and a suspension shaft extending in the horizontal direction is arranged on the plumbing arm; a T-shaped upper swing rod and an inverted-T-shaped lower swing rod are arranged on the suspension shaft in a sleeved mode, contact shafts are arranged at the two ends of the upper swing rod, an upper hanging shaft which is closer to the suspension shaft relative to the contact shafts is arranged in the middle of the upper swing rod, a scaling powder extruding device and a tin discharging device are arranged at the two ends of the lower swing rod respectively, and a second laser head with the power larger than that of the first laser head is arranged on one side of the tin discharging device. A lower hanging shaft is arranged in the middle of the lower swing rod, the upper hanging shaft and the lower hanging shaft are connected through a tension spring, a guide rail located above the upper swing rod is arranged at the bottom of the rotating plate, an inverted-triangle-shaped contact block is movably connected to the guide rail, and the bottom of the contact block can exactly pass through the upper hanging shaft when the contact block transversely moves along the guide rail.

Description

technical field [0001] The invention relates to the technical field of intelligent manufacturing equipment, in particular to an anti-splash laser soldering equipment and a welding method. Background technique [0002] Laser soldering equipment is a special equipment for intelligent manufacturing that uses laser irradiation to generate high temperature to fix the pins of components on the circuit board by soldering. After soldering, the components and other components on the circuit board are electrically connected. [0003] At present, the working principle of laser soldering equipment is roughly as follows: figure 1 , figure 2 , irradiate the laser beam (2) downward from the back of the circuit board (1) and focus it on the pins (3) of the component and the soldering hole (4) of the circuit board, and then place the solder wire (5) at the end from any side Contact the pin (3) and the solder hole (4), after the solder wire (5) melts, the tin diffuses from this side aroun...

AI Technical Summary

Problems solved by technology

Compared with solder, flux has a lower melting point and lower vaporization temperature, so it is prone to tin spatter during soldering, especially lead-free solder wire

[0005] However, the current circuit board integration is getting higher and higher, and tin splashes during the soldering process are likely to affect other components on the circuit board.

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