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Laser processing apparatus and method

A laser processing and laser technology, used in laser welding equipment, metal processing equipment, manufacturing tools, etc., can solve problems such as insufficient substrate accuracy, and achieve the effect of improved production adaptability and stable rate

Pending Publication Date: 2022-03-18
SHANGHAI IND U TECH RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0003] The technical problem to be solved by the present invention is to provide a laser processing device and method in order to overcome the defect of insufficient precision of substrate processing in the prior art

Method used

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  • Laser processing apparatus and method
  • Laser processing apparatus and method
  • Laser processing apparatus and method

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Experimental program
Comparison scheme
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Embodiment 1

[0052] This embodiment provides a laser processing device for forming fine structures on a substrate. Figure 1-3 A part of the laser processing device of this embodiment is shown, which includes the most basic components of the laser processing device of this embodiment, and the laser processing device may also have other components not shown.

[0053] In this embodiment, the substrate to be processed may be a semiconductor substrate or a non-semiconductor substrate. In the following description of this embodiment, a semiconductor substrate is taken as an example, but the following description is also applicable to the case where the substrate is a non-semiconductor substrate.

[0054]The laser processing device of this embodiment comprises a laser 1, a stage 3 carrying a substrate 2, an optical system 5 for guiding the laser 4 (or laser beam) emitted by the laser 1 to the substrate, and providing liquid 9 to the substrate to be processed. and form the liquid circulation syst...

Embodiment 2

[0072] This embodiment provides a laser processing method. In an optional implementation manner, the laser processing method is realized by using the laser processing device of Embodiment 1 to process microstructures. refer to Figure 9 , the laser processing method of the present embodiment comprises the following steps:

[0073] Step S301 , preparing a substrate.

[0074] Step S302, fixing the substrate on the stage.

[0075] Step S303 , putting the stage on which the substrate is fixed into the container of the liquid circulation system filled with liquid, so that the processed part of the surface of the substrate to be processed and the liquid form a solid-liquid interface.

[0076] Step S304, irradiating the solid-liquid interface of the substrate with a laser beam, and etching the processed part of the substrate to form a target pattern.

[0077] As an example, refer to Figure 10-15 In this embodiment, the laser processing method is used to process from the first m...

Embodiment 3

[0088] This embodiment provides a laser processing method. In an optional implementation manner, the laser processing method is realized by using the laser processing device of Embodiment 1 to process microstructures. The flow of the laser processing method of this embodiment is substantially the same as that of the laser processing method of Embodiment 2.

[0089] As an example, refer to Figure 17-20 In this embodiment, processing is performed from the first main surface 2 a side of the substrate 2 by using the laser processing method, and the formation of fine patterns on the surface of the substrate 2 is described as an example. Figure 17-19 is a cross-sectional view describing the laser processing method, Figure 20 is a plan view describing the laser processing method.

[0090] Such as Figure 10 As shown, in step S301, the substrate 2 is prepared first. As an example, the substrate 2 is, for example, a piezoelectric ceramic PZT (lead zirconate titanate) thin plate...

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Abstract

The invention discloses a laser processing device and method, and the device comprises a laser device which emits laser light; a stage which carries the substrate; an optical system that guides the laser light emitted by the laser to the substrate so as to irradiate the substrate with a light beam; and the liquid circulation system provides liquid to the processed position of the substrate, and a solid-liquid interface formed by the substrate and the liquid is formed at the processed position of the substrate. According to the invention, a single laser beam or a plurality of laser beams can be used for respectively or simultaneously processing the microstructure on the semiconductor substrate. In the machining process of the fine structure, due to the introduction of a liquid circulation system, the precision and the speed of etching generated on a solid-liquid interface irradiated by laser are stable, and the production adaptability is improved.

Description

technical field [0001] The present application relates to the technical field of micromachining, in particular to a laser processing device and method. Background technique [0002] In semiconductor devices, especially micro-electro-mechanical systems (MEMS: Micro Electro Mechanical Systems) devices, microstructures are often required. Sometimes, microstructures are complex in shape, including hollow structures; sometimes, thin films suspended over cavities are required. For example, some pressure sensors need to form a suspended film above the cavity. For another example, some microfluidic devices require a completely sealed micro-channel except for the inlet and outlet. Liquid is introduced at the inlet and liquid is discharged at the outlet. Detection, screening, Various desired purposes such as mixing and reaction. The microstructure of such a MEMS device is usually relatively complicated, and it is difficult to realize it simply by using the usual microfabrication te...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B23K26/362B23K26/064B23K26/70
CPCB23K26/362B23K26/064B23K26/702
Inventor 王诗男
Owner SHANGHAI IND U TECH RES INST