Wafer transfer position adjusting method and device

Abstract

The invention provides a wafer transfer position adjusting method and device, which are applied to the heating process of a wafer, and the adjusting method comprises the steps: obtaining a first local image of the wafer through a three-dimensional shooting device, and determining a first central position of the wafer according to the first local image; acquiring a second local image of a heater for heating the wafer through the three-dimensional shooting device, and determining a second central position of the heater according to the second local image; and calculating the spacing distance between the first central position and the second central position in the horizontal direction, and adjusting the wafer transfer position of the wafer according to the spacing distance and a preset distance threshold value. And the in-chip uniformity of the wafer processing technology is improved.

Description

technical field [0001] The invention relates to the technical field of semiconductor process cavity design, in particular to a method and a device for adjusting a wafer transfer position. Background technique [0002] In the wafer processing process, the common path for transferring wafers includes the equipment front-end module (Equipment FrontEnd Module, EFEM), vacuum lock (load lock, LL) chamber assembly, wafer transfer module (Transfer Module, TM) and process Module (process module, PM), after the wafer is transferred from the wafer transfer module to the process module, it is necessary to carry out wafer transfer calibration for each position of the wafer, so as to ensure that each time the wafer enters the process module after passing through the manipulator. Inside the chamber, after the positioning device is placed on the heater, it is just placed in the center of the heater, but this calibration can only be performed under normal temperature conditions. Under normal...

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Problems solved by technology

[0002] In the wafer processing process, the common path for transferring wafers includes the equipment front-end module (Equipment FrontEnd Module, EFEM), vacuum lock (load lock, LL) chamber assembly, wafer transfer module (Transfer Module, TM) and process Module (process module, PM), after the wafer is transferred from the wafer transfer module to the process module, it is necessary to carry out wafer transfer calibration for each position of the wafer, so as to ensure that each time the wafer enters the process module after passing through the manipulator. Inside the chamber, after the positioning device is placed on the heater, it is just placed in the center of the heater, but this calibration can only be performed under normal temperature conditions. Under normal temperature and vacuum conditions, after adjusting the film transfer position, open the cavity. Wafer confirmation, whether it is aligned with the center of the heating plate

However, under high-temperature heating conditions, since the heating chamber cannot be opened, it is impossible to accurately obtain whether the position of the wafer on the heating plate is accurate, so that the position of the wafer transfer cannot be adjusted, thereby affecting the wafer heating effect. , affecting the on-chip uniformity of wafer processing

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